IC,COMMUNICATIONS CONTROLLER,CMOS,DIP,40PIN
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -10 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 40 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| UPD72002C | UPD72002GB | UPD72002L | |
|---|---|---|---|
| Description | IC,COMMUNICATIONS CONTROLLER,CMOS,DIP,40PIN | IC,COMMUNICATIONS CONTROLLER,CMOS,QFP,44PIN | 1 CHANNEL(S), 2.5Mbps, MULTI PROTOCOL CONTROLLER, PQCC44, PLASTIC, LCC-44 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Parts packaging code | DIP | QFP | LCC |
| Contacts | 40 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T40 | S-PQFP-G44 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 | e0 |
| Number of terminals | 40 | 44 | 44 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -10 °C | -10 °C | -10 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QFP | QCCJ |
| Encapsulate equivalent code | DIP40,.6 | QFP44,.57SQ,32 | LDCC44,.7SQ |
| Package shape | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | FLATPACK | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 40 mA | 40 mA | 40 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | J BEND |
| Terminal pitch | 2.54 mm | 0.8 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD |