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X28C64GMB-20

Description
EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32
Categorystorage    storage   
File Size1MB,24 Pages
ManufacturerXicor Inc.
Download Datasheet Parametric View All

X28C64GMB-20 Overview

EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32

X28C64GMB-20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerXicor Inc.
package instructionFRIT SEALED, CERAMIC, LCC-32
Reach Compliance Codeunknown
Maximum access time200 ns
command user interfaceNO
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-GQCC-N32
JESD-609 codee0
length13.97 mm
memory density65536 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals32
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
page size64 words
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height3.048 mm
Maximum standby current0.0002 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
switch bitYES
width11.43 mm
Maximum write cycle time (tWC)10 ms
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