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2
Summary of Arria V Features
AV-51001
2013.05.06
Advantage
Supporting Feature
Lowest system cost
• Requires as low as four power supplies to operate
• Available in thermal composite flip chip ball-grid array (BGA) packaging
• Includes innovative features such as Configuration via Protocol (CvP),
partial reconfiguration, and design security
Summary of Arria V Features
Table 2: Summary of Features for Arria V Devices
Feature
Description
Technology
• TSMC's 28-nm process technology:
• Arria V GX, GT, SX, and ST—28-nm low power (28LP) process
• Arria V GZ—28-nm high performance (28HP) process
• Lowest static power in its class (less than 1.2 W for 500K logic elements (LEs) at 85°C
junction under typical conditions)
• 0.85 V, 1.1 V, or 1.15 V core nominal voltage
Packaging
• Thermal composite flip chip BGA packaging
• Multiple device densities with identical package footprints for seamless migration
between different device densities
• Lead, lead-free (Pb-free), and RoHS-compliant options
High-performance • Enhanced 8-input ALM with four registers
FPGA fabric
• Improved routing architecture to reduce congestion and improve compilation time
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Embedded System
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