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Z8720020FSG

Description
IC SPECIALTY TELECOM CIRCUIT, PQFP100, PLASTIC, QFP-100, Telecom IC:Other
CategoryWireless rf/communication    Telecom circuit   
File Size434KB,55 Pages
ManufacturerZilog, Inc.
Websitehttps://www.zilog.com/
Environmental Compliance  
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Z8720020FSG Overview

IC SPECIALTY TELECOM CIRCUIT, PQFP100, PLASTIC, QFP-100, Telecom IC:Other

Z8720020FSG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerZilog, Inc.
Parts packaging codeQFP
package instructionQFP,
Contacts100
Reach Compliance Codeunknown
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
Number of functions1
Number of terminals100
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height3.1 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width14 mm
Z87200
Spread-Spectrum
Transceiver
Product Specification
PS010202-0601
ZiLOG Worldwide Headquarters • 910 E. Hamilton Avenue • Campbell, CA 95008
Telephone: 408.558.8500 • Fax: 408.558.8300 •
www.ZiLOG.com

Z8720020FSG Related Products

Z8720020FSG Z8720020FSC
Description IC SPECIALTY TELECOM CIRCUIT, PQFP100, PLASTIC, QFP-100, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, PQFP100, PLASTIC, QFP-100, Telecom IC:Other
Is it lead-free? Lead free Contains lead
Is it Rohs certified? conform to incompatible
Maker Zilog, Inc. Zilog, Inc.
Parts packaging code QFP QFP
package instruction QFP, QFP, QFP100(UNSPEC)
Contacts 100 100
Reach Compliance Code unknown unknown
JESD-30 code R-PQFP-G100 R-PQFP-G100
JESD-609 code e3 e0
length 20 mm 20 mm
Number of functions 1 1
Number of terminals 100 100
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) 260 225
Certification status Not Qualified Not Qualified
Maximum seat height 3.1 mm 3.1 mm
Nominal supply voltage 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature 40 30
width 14 mm 14 mm
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