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ZL30316GKG2

Description
Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256
CategoryWireless rf/communication    Telecom circuit   
File Size112KB,5 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
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ZL30316GKG2 Overview

Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256

ZL30316GKG2 Parametric

Parameter NameAttribute value
MakerZarlink Semiconductor (Microsemi)
Objectid1801805457
package instructionBGA,
Reach Compliance Codeunknown
compound_id219692889
JESD-30 codeS-PBGA-B256
length17 mm
Number of functions1
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height1.97 mm
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width17 mm
ZL30316
Combined Synchronous Ethernet and
IEEE1588 Timing over Packet Technology
Data Sheet
A full Design Manual is available to qualified customers.
To register, please send an email to
TimingandSync@Zarlink.com.
June 2009
Features
Recovers and transmits network synchronization
over Ethernet, IP and MPLS Networks
Simultaneously supports both the Synchronous
Ethernet and the IEEE1588 industry standard timing
protocols
Capable of server, client and repeater operation
Integrates two separate digital phase locked loops,
with hitless switching between packet and electrical
clock references
Targeted for synchronization distribution to better
than ITU-T G.8261, G.823, G.824 and ANSI T1.101
synchronization interface standards
Average frequency accuracy better than ±10 ppb
Aligns to a low frequency input signal at server
(e.g., 1 Hz) with targeted accuracy better than ±1
μs
Recovers clocks from two independent servers, with
hitless switching between packet streams for
redundancy
Supports holdover if the server stream is lost
Accepts eight input references, and up to three
associated low frequency alignment or framing pulses
Generates up to four separate output clocks at
frequencies between 8 kHz and 100 MHz
Ordering Information
ZL30316GKG
256 TEPBGA, 17 x 17 mm
ZL30316GKG2
256 TEPBGA, 17 x 17 mm
-40°C to +85°C
Generates two separate Synchronous Ethernet
clocks to drive industry standard Ethernet PHY
devices at either 25 MHz or 125 MHz
Fully configurable solution, enabling performance
to be tailored to application/network requirements
Two independently configurable MAC interfaces,
supporting MII, RMII, GMII and TBI standards
Wire-speed Ethernet Bridge pass through function
between the MAC interfaces
Synchronous serial control interface
Full demonstration & evaluation platform available
Applications
IEEE 1588 and Synchronous Ethernet timing
GSM and UMTS air interface synchronization
over a packet network
Circuit Emulation Services over Packets
IP-PBX and VoIP Gateways
Video Conferencing
Broadband Video Distribution
ToP
Port M2
Network I/F
(GMII/TBI/MII/RMII)
osci
MAC
Ethernet Bridge
MAC
Port M1
Processor I/F
(GMII/TBI/MII/RMII)
Master
Osc
osco
Timestamp Engine
SSI
Register
Access I/F
PLL
ref0
ref1
ref2
ref3
ref4
ref5
ref6
ref7
sync0
sync1
sync2
ref
n
Input Ports
&
Ref
Monitors
sync
n
APLL
DPLL 1
Stratum 3
P0
Synthesizer
ETH_CLK0
ETH_CLK1
p0_clk0
p0_clk1
p0_fp0
p0_fp1
p1_clk0
p1_clk1
ref
m
DPLL2
P1
Synthesizer
Figure 1 - ZL30316 Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2009, Zarlink Semiconductor Inc. All Rights Reserved.

ZL30316GKG2 Related Products

ZL30316GKG2 ZL30316GKG
Description Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256 Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256
Maker Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction BGA, BGA,
Reach Compliance Code unknown unknown
JESD-30 code S-PBGA-B256 S-PBGA-B256
length 17 mm 17 mm
Number of functions 1 1
Number of terminals 256 256
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified
Maximum seat height 1.97 mm 1.97 mm
surface mount YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
width 17 mm 17 mm
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