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MC10H121
4−Wide OR−AND/OR−AND
Gate
Description
The MC10H121 is a basic logic building block providing the
simultaneous OR−AND/OR−AND−Invert function, useful in data
control and digital multiplexing applications. This MECL 10H™ part
is a functional/pinout duplication of the standard MECL 10K™ family
part, with 100% improvement in propagation delay, and no increase in
power− supply current.
Features
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MARKING DIAGRAMS*
16
MC10H121L
AWLYYWW
CDIP−16
L SUFFIX
CASE 620A
1
•
Propagation Delay, 1.0 ns Typical
•
Power Dissipation 100 mW/Gate Typical (same as MECL 10K)
•
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•
Voltage Compensated
•
MECL 10K Compatible
•
Pb−Free Packages are Available*
16
16
1
PDIP−16
P SUFFIX
CASE 648
1
MC10H121P
AWLYYWWG
10H121
ALYWG
SOEIAJ−16
CASE 966
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
10H121G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
February, 2006
−
Rev. 8
1
Publication Order Number:
MC10H121/D
MC10H121
4
5
6
7
9
10
11
12
13
14
15
V
CC1
= PIN 1
V
CC2
= PIN 16
V
EE
= PIN 8
2
3
V
CC1
A
OUT
A
OUT
A1
IN
A1
IN
A1
IN
A2
IN
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
A4
IN
A4
IN
A4
IN
A3
IN
A3
IN
A2
IN
, A3
IN
A2I
N
Pin assignment is for Dual−in−Line Package.
Figure 1. Logic Diagram
Figure 2. Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
Continuous
Surge
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
Plastic
Ceramic
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Operating Temperature Range
Storage Temperature Range
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
0°
Symbol
I
E
I
inH
Characteristic
Power Supply Current
Input Current High
Pins 3, 4, 5, 6, 7, 9
11, 12, 13, 14, 15
Pin 10
I
inL
V
OH
V
OL
V
IH
V
IL
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
0.5
−1.02
−1.95
−1.17
−1.95
−0.84
−1.63
−0.84
−1.48
500
610
0.5
−0.98
−1.95
−1.13
−1.95
−0.81
−1.63
−0.81
−1.48
295
360
0.3
−0.92
−1.95
−1.07
−1.95
−0.735
−1.60
−0.735
−1.45
295
360
mA
Vdc
Vdc
Vdc
Vdc
Min
Max
29
Min
25°
Max
26
Min
75°
Max
29
Unit
mA
mA
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50
W
resistor to
−2.0
V.
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2
MC10H121
Table 3. AC CHARACTERISTIC
0°
Symbol
t
pd
Characteristic
Propagation Delay
Pin 10 Only
Exclude Pin 10
Rise Time
Fall Time
Min
0.45
0.55
0.5
0.5
Max
1.8
1.95
1.7
1.7
Min
0.45
0.6
0.5
0.5
25°
Max
1.8
2.0
1.8
1.8
Min
0.55
0.7
0.5
0.5
75°
Max
2.2
2.4
1.9
1.9
ns
ns
Unit
ns
t
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
Device
MC10H121FN
MC10H121FNG
MC10H121FNR2
MC10H121FNR2G
MC10H121L
MC10H121M
MC10H121MG
MC10H121MEL
MC10H121MELG
MC10H121P
MC10H121PG
Package
PLLC−20
PLLC−20
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
CDIP−16
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
PDIP−16
PDIP−16
(Pb−Free)
Shipping
†
46 Units / Rail
46 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
25 Unit / Rail
50 Unit / Rail
50 Unit / Rail
2000 / Tape & Reel
2000 / Tape & Reel
25 Unit / Rail
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H121
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
0.004 (0.100)
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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4
Embedded System
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