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DSB5712E3

Description
SIGNAL DIODE
CategoryDiscrete semiconductor    diode   
File Size432KB,7 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

DSB5712E3 Overview

SIGNAL DIODE

DSB5712E3 Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionROHS COMPLIANT, HERMETIC SEALED, DO-35, GLASS PACKAGE-2
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JEDEC-95 codeDO-204AH
JESD-30 codeO-LALF-W2
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Maximum output current0.075 A
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Maximum repetitive peak reverse voltage16 V
surface mountNO
technologySCHOTTKY
Terminal formWIRE
Terminal locationAXIAL
1N5711-1, 1N5712-1, 1N6857-1, and
1N6858-1; DSB2810 and DSB5712
Qualified Levels:
JAN, JANTX, and
JANTXV
Available on
commercial
versions
Schottky Barrier Diode
Qualified per MIL-PRF-19500/444
DESCRIPTION
This Schottky barrier diode is metallurgically bonded and offers military grade qualifications
for high-reliability applications on “1N” prefixed numbers. This small diode is hermetically
sealed and bonded into a DO-35 glass package.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered 1N5711-1, 1N5712-1, 1N6857-1, and 1N6858-1 numbers.
Metallurgically bonded.
JAN, JANTX, JANTXV and commercial qualifications also available per MIL-PRF-19500/444 on
“1N” numbers only.
(See
Part Nomenclature
for all available options).
RoHS compliant versions available (commercial grade only).
DO-35
(DO-204AH)
Package
Also available in:
UB package
(3-pin surface mount)
1N5711UB, 1N5712UB
(B, CC, CA)
DO-213AA package
APPLICATIONS / BENEFITS
Low reverse leakage characteristics.
Small size for high density mounting using flexible thru-hole leads (see package illustration).
ESD sensitive to Class 1.
(surface mount)
1N5711UR-1, 1N5712UR-1,
1N6857UR-1, and
1N6858UR-1
MAXIMUM RATINGS
@ 25 ºC unless otherwise stated
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance, Junction-to-Lead
@ lead length = 0.375 inch (9.52 mm) from body
Average Rectified Output Current:
1N5711
(2)
DSB2810, DSB5712, 1N5712 & 1N6858
(3)
1N6857
Solder Temperature @ 10 s
NOTES:
1. At T
L
= +130°C and L = 0.375 inch, derate I
O
to 0 at +150°C.
2. At T
L
= +110°C and L = 0.375 inch, derate I
O
to 0 at +150°C.
3. At T
L
= +70°C and L = 0.375 inch, derate I
O
to 0 at +150°C.
(1)
Symbol
T
J
and T
STG
R
ӨJL
Value
-65 to +150
250
Unit
ºC
ºC/W
I
O
33
75
150
260
mA
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
o
C
T4-LDS-0040, Rev. 4 (6/4/13)
©2013 Microsemi Corporation
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