Operating Temperature Range..............................-40°C to +125°C
Storage Temperature Range .................................-65°C to +150°C
Junction Temperature ...........................................................+150°C
Lead Temperature (soldering, 10s)......................................+300°C
Soldering Temperature (reflow)............................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Junction-to-Ambient Thermal Resistance (θ
JA
)...............42°C/W
Junction-to-Case Thermal Resistance (θ
JC
)......................9°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
DD
= 4V to 15V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at V
DD
= 15V and T
A
= +25°C.) (Note 1)
PARAMETER
POWER SUPPLY
V
DD
Operating Range
V
DD
Undervoltage Lockout
V
DD
Undervoltage Lockout
Hysteresis
V
DD
Undervoltage Lockout to
Output Delay
V
DD
Supply Current
DRIVER OUTPUT (SINK)
Driver Output Resistance Pulling
Down
Peak Output Current (Sinking)
Output-Voltage Low
Latchup Protection
DRIVER OUTPUT (SOURCE)
Driver Output Resistance Pulling
Up
Peak Output Current (Sourcing)
V
DD
= 15V,
I
OUT
= 100mA
V
DD
= 4.5V,
I
OUT
= 100mA
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
1.5
1.9
2.75
3.75
4
2.1
2.75
4
5.5
A
Ω
I
LUP
V
DD
= 15V,
I
OUT
= -100mA
V
DD
= 4.5V,
I
OUT
= -100mA
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
V
DD
= 4.5V
V
DD
= 15V
400
1.1
1.5
2.2
3.0
4
0.45
0.24
1.8
2.4
3.3
4.5
A
V
mA
Ω
I
DD
I
DD-SW
V
DD
rising
V
IN+
= 0V, IN- = V
DD
(not switching)
V
DD
= 4V
V
DD
= 15V
0.5
V
DD
UVLO
V
DD
rising
4
3.00
3.5
200
12
28
40
1.2
55
75
2.2
15
3.85
V
V
mV
µs
µA
mA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Switching at 250kHz, C
L
= 0
R
ON-N
I
PK-N
V
DD
= 15V, C
L
= 10,000pF
I
OUT
= -100mA
Reverse current I
OUT
(Note 2)
R
ON-P
I
PK-P
V
DD
= 15V, C
L
= 10,000pF
2
Maxim Integrated
MAX5078
4A, 20ns, MOSFET Driver
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 4V to 15V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at V
DD
= 15V and T
A
= +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
V
DD
= 4.5V
Output-Voltage High
I
OUT
= 100mA
V
DD
= 15V
LOGIC INPUT
(Note 3)
Logic 1 Input Voltage
V
IH
MAX5078A
MAX5078B (Note 4)
Logic 0 Input Voltage
V
IL
MAX5078A
MAX5078B
Logic-Input Hysteresis
Logic-Input-Current Leakage
Input Capacitance
C
IN
C
L
= 1000pF
OUT Rise Time
t
R
C
L
= 5000pF
C
L
= 10,000pF
C
L
= 1000pF
OUT Fall Time
Turn-On Delay Time
Turn-Off Delay Time
t
F
t
D-ON
t
D-OFF
C
L
= 5000pF
C
L
= 10,000pF
C
L
= 10,000pF (Note 2)
C
L
= 10,000pF (Note 2)
C
L
= 1000pF
OUT Rise Time
t
R
C
L
= 5000pF
C
L
= 10,000pF
C
L
= 1000pF
OUT Fall Time
Turn-On Delay Time
Turn-Off Delay Time
t
F
t
D-ON
t
D-OFF
C
L
= 5000pF
C
L
= 10,000pF
C
L
= 10,000pF (Note 2)
C
L
= 10,000pF (Note 2)
18
18
10
10
V
HYS
MAX5078A
MAX5078B
V
IN+
= V
IN-
= 0V or V
DD
-1
0.1 x
V
DD
0.3
+0.1
2.5
4
18
32
4
15
26
20
20
7
37
85
7
30
75
35
35
70
70
ns
ns
ns
ns
34
34
ns
ns
ns
ns
+1
µA
pF
0.7 x
V
DD
2.1
0.3 x
V
DD
0.8
V
V
V
MIN
V
DD
-
0.55
V
V
DD
-
0.275
TYP
MAX
UNITS
SWITCHING CHARACTERISTICS FOR V
DD
= 15V
(Figure 1)
SWITCHING CHARACTERISTICS FOR V
DD
= 4.5V
(Figure 1)
Maxim Integrated
3
MAX5078
4A, 20ns, MOSFET Driver
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 4V to 15V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at V
DD
= 15V and T
A
= +25°C.) (Note 1)
PARAMETER
MATCHING CHARACTERISTICS
Mismatch Propagation Delays from
Inverting and Noninverting Inputs to
Output
∆t
ON-OFF
V
DD
= 15V, C
L
= 10,000pF
V
DD
= 4.5V, C
L
= 10,000pF
2
ns
4
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Note 1:
Note 2:
Note 3:
Note 4:
All devices are 100% tested at T
A
= +25°C. Specifications over -40°C to +125°C are guaranteed by design.
Limits are guaranteed by design, not production tested.
I use tim1 to output a fixed frequency pwm. Now I count a few pulses in the interrupt and force the output to a low level, and then it returns to normal after a few pulses. In the oscilloscope, I see ...
The bitmap I displayed with directdraw doesn't match the background very well, and the jagged edges are serious. I checked online and found that DD does not support ALPHA operation.... How can I make ...
I would like to recommend an open source PCB design software KICAD. I just found a video tutorial on another forum and would like to share it with you. Baidu Netdisk: [url=http://pan.baidu.com/s/1hqNn...
"Originally, there are many people who can design very good
chips
, but the market does not give domestic
chips
the opportunity to iterate, and domestic companies cannot give engine...[Details]
On April 20, the Photovoltaic Summit, guided by Jiangsu Renewable Energy Industry Association, hosted by Growatt, and supported by LONGi Solar Technology Co., Ltd. and Jiangsu Bigo New Energy Group...[Details]
On April 24, Sungrow released its annual financial report. The report shows that in 2017, Sungrow's global shipments reached 16.5GW, of which domestic shipments reached 13.2GW, a year-on-year incre...[Details]
1. Usage scenarios In the first case, when using a common STM32 delay function, similar to HAL_Delay(time), since this function uses a loop to judge and delay, when executing this function, the ent...[Details]
We have come a long way from the 2G era, and now 5G is about to be commercialized. Suddenly, we realize that time has passed quickly, but technology has never stopped. The activation of 5G heralds ...[Details]
Recently, there was news that the US government asked Google to shut down the Android operating system for ZTE phones. After that, some people even imagined what the consequences would be if Intern...[Details]
Chip: STM32F107VCT6 Application Pin: THOUSANDS, RMII STM32CubeMX is very convenient to use ETH. The software comes with LWIP and configuration. This time, STM32F107VCT6+DP83848CVV is used. The MII a...[Details]
The Wassenaar Arrangement, everything started during the Cold War. Let's learn more about it with the embedded editor.
background
After the end of World War II, the United States ...[Details]
The adoption rate of serverless
cloud
computing
is gradually increasing, but it has not yet reached people's expectations. Various surveys show that serverless
is
still
an eme...[Details]
This program mainly uses the comparison output function of the timer to generate PWM waves to control the LED. The comparison output of timer A corresponds to P2.3 P2.4. Therefore, a matching working...[Details]
This routine is also a classic routine on the development board. I modified the framework of the program to make it more suitable for future calls. The specific 4*4 keyboard scanning principle is rel...[Details]
Recently, Zhejiang Lipu Crushing Equipment Co., Ltd. invested 50 million yuan to build a new "annual production of 1,200 high-efficiency and energy-saving ultra-fine pulverizer construction project...[Details]
China Energy Storage Network News:
On the 7th, Jurong Economic Development Zone signed a strategic cooperation framework agreement on comprehensive energy services with State Grid Jiangsu Int...[Details]
1. Brief description A summary of "How to build uClinux kernel transplantation on ARMSYS development board with S3C44B0X as core", including the analysis of Bootloader function and the key co...[Details]
In recent years, the application of high-brightness LED has developed rapidly, especially in signboards and traffic lights. For automotive applications, LED is also very attractive. Long life, shock ...[Details]