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W25P025AF-6

Description
Standard SRAM, 64KX32, 6ns, CMOS, PQFP100, MO-108, QFP-100
Categorystorage    storage   
File Size440KB,17 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W25P025AF-6 Overview

Standard SRAM, 64KX32, 6ns, CMOS, PQFP100, MO-108, QFP-100

W25P025AF-6 Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Parts packaging codeQFP
package instructionQFP,
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time6 ns
JESD-30 codeR-PQFP-G100
length20 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals100
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX32
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3.32 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm

W25P025AF-6 Related Products

W25P025AF-6 W25P025AF-6F W25P025AD-7F W25P025AD-6F W25P025AF-7F W25P025AD-6 W25P025AD-7 W25P025AF-7
Description Standard SRAM, 64KX32, 6ns, CMOS, PQFP100, MO-108, QFP-100 Standard SRAM, 64KX32, 6ns, CMOS, PQFP100, MO-108, QFP-100 Standard SRAM, 64KX32, 7ns, CMOS, PQFP100, MO-136, TQFP-100 Standard SRAM, 64KX32, 6ns, CMOS, PQFP100, MO-136, TQFP-100 Standard SRAM, 64KX32, 7ns, CMOS, PQFP100, MO-108, QFP-100 Standard SRAM, 64KX32, 6ns, CMOS, PQFP100, MO-136, TQFP-100 Standard SRAM, 64KX32, 7ns, CMOS, PQFP100, MO-136, TQFP-100 Standard SRAM, 64KX32, 7ns, CMOS, PQFP100, MO-108, QFP-100
Maker Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP
package instruction QFP, QFP, LQFP, LQFP, QFP, LQFP, LQFP, QFP,
Contacts 100 100 100 100 100 100 100 100
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 6 ns 6 ns 7 ns 6 ns 7 ns 6 ns 7 ns 7 ns
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100 100 100
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000 64000 64000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C
organize 64KX32 64KX32 64KX32 64KX32 64KX32 64KX32 64KX32 64KX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP LQFP LQFP QFP LQFP LQFP QFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.32 mm 3.32 mm 1.6 mm 1.6 mm 3.32 mm 1.6 mm 1.6 mm 3.32 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL OTHER OTHER OTHER OTHER COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
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