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DN6N08LTE

Description
Diode Termination Array, 6-Line, PDSO8, PLASTIC, SOIC-8
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size92KB,2 Pages
ManufacturerKOA Speer
Websitehttp://www.koaspeer.com/
Related ProductsFound1parts with similar functions to DN6N08LTE
Download Datasheet Parametric Compare View All

DN6N08LTE Overview

Diode Termination Array, 6-Line, PDSO8, PLASTIC, SOIC-8

DN6N08LTE Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeSOIC
package instructionSOP,
Contacts8
Reach Compliance Code_compli
ECCN codeEAR99
Differential outputNO
Interface integrated circuit typeDIODE BUS TERMINATION ARRAY
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.83 mm
Humidity sensitivity level1
Number of functions1
Number of signal lines6
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.8 mm
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
DN(X)
diode terminator network
features
Fast reverse recovery time
Fast turn on time
Low capacitance
SMD packages
16 kV IEC61000-4-2 capable
circuit
protection
applications
Singal termination
Signal conditioning
dimensions and construction
S03
L
p
Bonding
Wire
Die
Pad
W
Molded
Resin
Si
Wafer
Lead
d
Molded
Resin
W
Die
Si Pad
Wafer
ESD suppression
Transient suppression
S14
L
p
Bonding
Wire
Lead
d
Package Total
Code Power
S03
S14
S06
N08
225mw
225mw
225mw
400mw
1200mw
1000mw
1000mw
Pins
3
4
6
8
20
20
24
Dimensions
inches
(mm)
L ±0.2 W ±0.2 p ±0.1
Pkg Ht
d ±0.05
±0.2
.115
(2.92)
.115
(2.92)
.115
(2.92)
.190
(4.83)
.500
(12.7)
.341
(8.66)
.341
(8.66)
.091
(2.30)
.091
(2.30)
.110
(2.80)
.236
(5.99)
.408
(10.36)
.236
(5.99)
.236
(5.99)
.075
(1.91)
.075
(1.91)
.075
(1.91)
.050
(1.27)
.050
(1.27)
.025
(0.635)
.025
(0.635)
.037
(0.95)
.037
(0.95)
.037
(0.95)
.063
(1.60)
.084
(2.40)
.063
(1.60)
.063
(1.60)
.017
(0.43)
.017
(0.43)
.017
(0.43)
.016
(0.41)
.016
(0.41)
.010
(0.25)
.010
(0.25)
S06
L
p
N08, W20,
Q20, Q24
Bonding
Wire
Lead
L
Bonding
Wire
d
p
Lead
W20
Q20
Q24
W
Si
Wafer
Molded
Resin
W
d
Die
Pad
Die
Pad
Si
Wafer
Molded
Resin
circuit schematic
1
1
DN2:
20 pins
DN2:
20 pins
1
DN3:
6 pins
1
DN4:
4 pins
1
DN5:
24 pins
1
DN6:
8 pins
1
DN7:
24 pins
1
DN8
For further information on packaging, please refer to Appendix C.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
1/12/05
154
KOA Speer Electronics, Inc.
• Bolivar Drive • P Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
.O.

DN6N08LTE Related Products

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