PC755BVZFU300LD datasheet, PDF

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PC755BVZFU300LD: DescriptionRISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size277KB，48 Pages; ManufacturerThomson-CSF Compsants Specific

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PC755BVZFU300LD Overview

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360,

PC755BVZFU300LD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Thomson-CSF Compsants Specific
package instruction	BGA, BGA360,19X19,50
Reach Compliance Code	unknown
bit size	32
JESD-30 code	S-PBGA-B360
JESD-609 code	e0
Number of terminals	360
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA360,19X19,50
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.8/3.3 V
Certification status	Not Qualified
speed	300 MHz
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Features

18.1SPECint95, estimates 12.3 SPECfp95 @400Mhz (PC755B)

15.7SPECint95, 9SPECfp95 @350Mhz (PC745B)

733 MIPS @ 400Mhz (PC755B) et 641 MIPS@350Mhz (PC745B)

Selectable bus clock (12 CPU bus dividers up to 10x)

typical 6,4W @ 400Mhz, full operating conditions.

Nap, doze and sleep modes for power savings

Superscalar (3 instructions per clock cycle) (two instruction + branch)

4 PetaByte virtual memory, 4 Gigabytes of physical memory.

64-bit data and 32-bit address bus interface.

32KB instruction and data cache.

Six independent execution units.

Write-back and write-through operations.

int

max = 400Mhz (TBC)

bus

max = 100Mhz

Voltage I/O 1,8V/3,3V ; voltage int 2.0 V

PowerPC755B/745B

RISC MICROPRO-

CESSOR

Preliminary

Specification

α-site

Description

PC755B and PC745B PowerPC microprocessors are high-performance, low-power, 32-bit

implementations of the PowerPC Reduced Instruction Set Computer (RISC) architecture, spe-

cially enhanced for embedded applications.

PC755B and PC745B microprocessors differ only in that the PC755B features an enhanced,

dedicated L2 cache interface with on-chip L2 tags. The PC755B is a drop-in replacement fo r the

award winning PowerPC 750

microprocessor and is footprint and user software code compat-

ible with the MPC7400 microprocessor withAltiVec

technology. The PC745B is a drop-in

replacement for the PowerPC 740

microprocessor and is also footprint and user soltware

code compatible with the PowerPC 603e

microprocessor. PC755B/745B microprocessors

provide on-chip debug support and are fully JTAG-compliant.

The PC745B microprocessor is pin compatible with the TSPC603e family.

PC755B/745B

ZF suffix

PBGA255

Flip-Chip Plastic Ball Grid Array

PBGA360

Flip-Chip Plastic Ball Grid Array

Screening

This product is manufactured in full compliance with :

CBGA upscreenings based upon ATMEL-Grenoble standards

Full military temperature range (Tj=-55

C,+125

industrial temperature range (Tj=-40

C,+110

September 2000

1/48

PC755BVZFU300LD Related Products

	PC755BVZFU300LD	PC755BMZFU300LD	PC755BVZFU400LE	PC755BMZFU350LE	PC755BMZFU400LD	PC755BMZFU400LE
Description	RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360,	RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360,	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360,	RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360,	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360,	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Thomson-CSF Compsants Specific	Thomson-CSF Compsants Specific	Thomson-CSF Compsants Specific	Thomson-CSF Compsants Specific	Thomson-CSF Compsants Specific	Thomson-CSF Compsants Specific
package instruction	BGA, BGA360,19X19,50	BGA, BGA360,19X19,50	BGA, BGA360,19X19,50	BGA, BGA360,19X19,50	BGA, BGA360,19X19,50	BGA, BGA360,19X19,50
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
bit size	32	32	32	32	32	32
JESD-30 code	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	360	360	360	360	360	360
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA360,19X19,50	BGA360,19X19,50	BGA360,19X19,50	BGA360,19X19,50	BGA360,19X19,50	BGA360,19X19,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
power supply	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	300 MHz	300 MHz	400 MHz	350 MHz	400 MHz	400 MHz
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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