EEWORLDEEWORLDEEWORLD

Part Number

Search

PC755BMZFU350LE

Description
RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size277KB,48 Pages
ManufacturerThomson-CSF Compsants Specific
Download Datasheet Parametric Compare View All

PC755BMZFU350LE Overview

RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360,

PC755BMZFU350LE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerThomson-CSF Compsants Specific
package instructionBGA, BGA360,19X19,50
Reach Compliance Codeunknown
bit size32
JESD-30 codeS-PBGA-B360
JESD-609 codee0
Number of terminals360
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA360,19X19,50
Package shapeSQUARE
Package formGRID ARRAY
power supply1.8/3.3 V
Certification statusNot Qualified
speed350 MHz
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Features
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
18.1SPECint95, estimates 12.3 SPECfp95 @400Mhz (PC755B)
15.7SPECint95, 9SPECfp95 @350Mhz (PC745B)
733 MIPS @ 400Mhz (PC755B) et 641 MIPS@350Mhz (PC745B)
Selectable bus clock (12 CPU bus dividers up to 10x)
P
D
typical 6,4W @ 400Mhz, full operating conditions.
Nap, doze and sleep modes for power savings
Superscalar (3 instructions per clock cycle) (two instruction + branch)
4 PetaByte virtual memory, 4 Gigabytes of physical memory.
64-bit data and 32-bit address bus interface.
32KB instruction and data cache.
Six independent execution units.
Write-back and write-through operations.
f
int
max = 400Mhz (TBC)
f
bus
max = 100Mhz
Voltage I/O 1,8V/3,3V ; voltage int 2.0 V
PowerPC755B/745B
RISC MICROPRO-
CESSOR
Preliminary
Specification
α-site
Description
PC755B and PC745B PowerPC microprocessors are high-performance, low-power, 32-bit
implementations of the PowerPC Reduced Instruction Set Computer (RISC) architecture, spe-
cially enhanced for embedded applications.
PC755B and PC745B microprocessors differ only in that the PC755B features an enhanced,
dedicated L2 cache interface with on-chip L2 tags. The PC755B is a drop-in replacement fo r the
award winning PowerPC 750
TM
microprocessor and is footprint and user software code compat-
ible with the MPC7400 microprocessor withAltiVec
TM
technology. The PC745B is a drop-in
replacement for the PowerPC 740
TM
microprocessor and is also footprint and user soltware
code compatible with the PowerPC 603e
TM
microprocessor. PC755B/745B microprocessors
provide on-chip debug support and are fully JTAG-compliant.
The PC745B microprocessor is pin compatible with the TSPC603e family.
PC755B/745B
ZF suffix
ZF suffix
PBGA255
Flip-Chip Plastic Ball Grid Array
PBGA360
Flip-Chip Plastic Ball Grid Array
Screening
This product is manufactured in full compliance with :
H
CBGA upscreenings based upon ATMEL-Grenoble standards
H
Full military temperature range (Tj=-55
o
C,+125
o
C)
industrial temperature range (Tj=-40
o
C,+110
o
C)
September 2000
1/48

PC755BMZFU350LE Related Products

PC755BMZFU350LE PC755BMZFU300LD PC755BVZFU400LE PC755BMZFU400LD PC755BVZFU300LD PC755BMZFU400LE
Description RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Thomson-CSF Compsants Specific Thomson-CSF Compsants Specific Thomson-CSF Compsants Specific Thomson-CSF Compsants Specific Thomson-CSF Compsants Specific Thomson-CSF Compsants Specific
package instruction BGA, BGA360,19X19,50 BGA, BGA360,19X19,50 BGA, BGA360,19X19,50 BGA, BGA360,19X19,50 BGA, BGA360,19X19,50 BGA, BGA360,19X19,50
Reach Compliance Code unknown unknown unknown unknown unknown unknow
bit size 32 32 32 32 32 32
JESD-30 code S-PBGA-B360 S-PBGA-B360 S-PBGA-B360 S-PBGA-B360 S-PBGA-B360 S-PBGA-B360
JESD-609 code e0 e0 e0 e0 e0 e0
Number of terminals 360 360 360 360 360 360
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA360,19X19,50 BGA360,19X19,50 BGA360,19X19,50 BGA360,19X19,50 BGA360,19X19,50 BGA360,19X19,50
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
speed 350 MHz 300 MHz 400 MHz 400 MHz 300 MHz 400 MHz
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Now that Cyclone IV is out, let's discuss it.
The Cyclone IV FPGA series includes two models, Cyclone IV GX and Cyclone IV E. Cyclone IV GX has 150K logic elements (LEs), 6.5-Mbit RAM, 360 multipliers, and 8 integrated 3.125-Gbps transceivers tha...
凯哥 FPGA/CPLD
Simple energy-saving power strip power meter
Simple energy-saving power strip power meter...
chenzhufly Renesas Electronics MCUs
tornado shell cannot find symbol table
Problem description: I wrote a run() function for the vxworks usrAppInit() function to call. The code in it is to download the application file from ftp, then use loadModuleAt to load the symbol table...
huoyunbx Embedded System
Participate in the HELPER2416 development board scholarship program: Day 1
[i=s] This post was last edited by hongyancl on 2014-7-9 22:55[/i] [align=center][align=center][b][color=#444444][size=16.0pt]Participation[/size][/color][/b][b][color=#444444][size=16.0pt]HELPER2416[...
hongyancl Embedded System
There is a problem with the ADS compilation file, please help
There is a problem when ADS compiles NBOOT1st file. ADS prompts that it cannot open the file error G:\...\bootsrc\NBOOT1stboot_Data\DebugRel\ObjecCodeand_s.o; Question 1: My nand_s.o file is located a...
jiazheng535 Embedded System
The 5G era is within reach! Qorvo RF Fusion has been successfully applied to many new smartphone designs
[i=s]This post was last edited by alan000345 on 2019-3-27 13:47[/i] [p=25, null, left]Qorvo recently announced that several new smartphone designs have successfully adopted the latest generation of RF...
alan000345 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 710  321  1831  1640  1945  15  7  37  34  40 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号