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IDT72V3633L12PF9

Description
FIFO, 512X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128
Categorystorage    storage   
File Size221KB,27 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72V3633L12PF9 Overview

FIFO, 512X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128

IDT72V3633L12PF9 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionTQFP-128
Contacts128
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time8 ns
period time12 ns
JESD-30 codeR-PQFP-G128
JESD-609 codee0
length20 mm
memory density18432 bit
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals128
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512X36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
3.3 VOLT CMOS SyncFIFO
TM
WITH BUS-MATCHING
256 x 36, 512 x 36, 1,024 x 36
FEATURES:
• Memory storage capacity:
IDT72V3623–256 x 36
IDT72V3633–512 x 36
IDT72V3643–1,024 x 36
• Clock frequencies up to 83 MHz (8 ns access time)
• Clocked FIFO buffering data from Port A to Port B
FF)
• IDT Standard timing (using
EF
and
FF
or First Word Fall
Through Timing (using OR and IR flag functions)
• Programmable Almost-Empty and Almost-Full flags; each has
three default offsets (8, 16 and 64)
• Serial or parallel programming of partial flags
• Port B bus sizing of 36 bits (long word), 18 bits (word) and 9 bits
(byte)
PRELIMINARY
IDT72V3623
IDT72V3633
IDT72V3643
• Big- or Little-Endian format for word and byte bus sizes
• Reset clears data and configures FIFO, Partial Reset clears data
but retains configuration settings
• Mailbox bypass registers for each FIFO
• Free-running CLKA and CLKB may be asynchronous or
coincident (simultaneous reading and writing of data on a single
clock edge is permitted)
• Easily expandable in width and depth
• Auto power down minimizes power dissipation
• Available in a space-saving 128-pin Thin Quad Flatpack (TQFP)
• Pin and functionally compatible versions of the 5V operating
IDT723623/723633/723643
• Industrial temperature range (–40
o
C to +85
o
C) is available
FUNCTIONAL BLOCK DIAGRAM
MBF1
Mail 1
Register
Port-A
Control
Logic
Bus-
Matching
Input
Register
Output
Register
36
CLKA
CSA
W/RA
ENA
MBA
RS1
RS2
PRS
RAM ARRAY
36
FIFO1
Mail1,
Mail2,
Reset
Logic
36
256 x 36
512 x 36
1,024 x 36
36
A
0
-A
35
Write
Pointer
Read
Pointer
B
0
-B
35
FF/IR
AF
Status Flag
Logic
EF/OR
AE
36
36
SPM
FS0/SD
FS1/SEN
Programmable Flag
Offset Registers
9
Timing
Mode
Port-B
Control
Logic
Mail 2
Register
MBF2
FWFT
CLKB
CSB
W/RB
ENB
MBB
BE
BM
SIZE
4662 drw 01
June 1999
1
©
1999
Integrated Device Technology, Inc.
DSC-4662/-

IDT72V3633L12PF9 Related Products

IDT72V3633L12PF9 IDT72V3643L12PF9 IDT72V3643L12PF8 IDT72V3623L12PF8 IDT72V3643L12PF IDT72V3623L12PF IDT72V3623L12PF9 IDT72V3633L12PF8 IDT72V3633L12PF
Description FIFO, 512X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 1KX36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 1KX36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 256X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 1KX36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 256X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 256X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 512X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 512X36, 8ns, Synchronous, CMOS, PQFP128, TQFP-128
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP QFP
package instruction TQFP-128 TQFP-128 LFQFP, LFQFP, TQFP-128 TQFP-128 TQFP-128 TQFP-128 TQFP-128
Contacts 128 128 128 128 128 128 128 128 128
Reach Compliance Code compliant compliant compliant compliant not_compliant not_compliant compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 8 ns 8 ns 8 ns 8 ns 8 ns 8 ns 8 ns 8 ns 8 ns
period time 12 ns 12 ns 12 ns 12 ns 12 ns 12 ns 12 ns 12 ns 12 ns
JESD-30 code R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 18432 bit 36864 bit 36864 bit 9216 bit 36864 bit 9216 bit 9216 bit 18432 bit 18432 bit
memory width 36 36 36 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 128 128 128 128 128 128 128 128 128
word count 512 words 1024 words 1024 words 256 words 1024 words 256 words 256 words 512 words 512 words
character code 512 1000 1000 256 1000 256 256 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512X36 1KX36 1KX36 256X36 1KX36 256X36 256X36 512X36 512X36
Exportable YES YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240 240 240 240 240 240 240
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) TIN LEAD TIN LEAD Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 20 20 20 20 20 20 20 20 20
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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