SRAM Module, 256KX8, 35ns, CMOS,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Twilight Technology Inc. |
| package instruction | ZIP, ZIP44,.1,.1 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 35 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XZMA-T44 |
| memory density | 2097152 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| encapsulated code | ZIP |
| Encapsulate equivalent code | ZIP44,.1,.1 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.08 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 1.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| DPS8256P8-35C | DPS8256P8-25C | DPS8256P8-55C | DPS8256P8-45C | |
|---|---|---|---|---|
| Description | SRAM Module, 256KX8, 35ns, CMOS, | SRAM Module, 256KX8, 25ns, CMOS, | SRAM Module, 256KX8, 55ns, CMOS | SRAM Module, 256KX8, 45ns, CMOS |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | ZIP, ZIP44,.1,.1 | ZIP, ZIP44,.1,.1 | ZIP, ZIP44,.1,.1 | ZIP, ZIP44,.1,.1 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 35 ns | 25 ns | 55 ns | 45 ns |
| I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-XZMA-T44 | R-XZMA-T44 | R-XZMA-T44 | R-XZMA-T44 |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 44 | 44 | 44 | 44 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | ZIP | ZIP | ZIP | ZIP |
| Encapsulate equivalent code | ZIP44,.1,.1 | ZIP44,.1,.1 | ZIP44,.1,.1 | ZIP44,.1,.1 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.08 A | 0.08 A | 0.08 A | 0.08 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 1.12 mA | 1.12 mA | 1.12 mA | 1.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maker | Twilight Technology Inc. | - | Twilight Technology Inc. | Twilight Technology Inc. |
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