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DS1650YL-70

Description
Non-Volatile SRAM Module, 512KX8, 70ns, CMOS,
Categorystorage    storage   
File Size96KB,12 Pages
ManufacturerDALLAS
Websitehttp://www.dalsemi.com
Download Datasheet Parametric View All

DS1650YL-70 Overview

Non-Volatile SRAM Module, 512KX8, 70ns, CMOS,

DS1650YL-70 Parametric

Parameter NameAttribute value
MakerDALLAS
Reach Compliance Codeunknown
Maximum access time70 ns
Other features10 YEAR DATA RETENTION
JESD-30 codeR-XDSO-U34
memory density4194304 bit
Memory IC TypeNON-VOLATILE SRAM MODULE
memory width8
Number of functions1
Number of terminals34
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Package body materialUNSPECIFIED
Encapsulate equivalent codeMODULE,34LEAD,1.0
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.005 A
Maximum slew rate0.085 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formJ INVERTED
Terminal locationDUAL
DS1650Y/AB
DS1650Y/AB
Partitionable 4096K NV SRAM
FEATURES
PIN ASSIGNMENT
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
A17
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
10 years minimum data retention in the absence of
external power
Data is automatically protected during power loss
Directly replaces 512K x 8 volatile static RAM
Write protects selected blocks of memory when pro-
grammed
Unlimited write cycles
Low-power CMOS
Read and write access times as fast as 70 ns
Lithium energy source is electrically disconnected to
retain freshness until power is applied for the first time
Full +10% V
CC
operating range (DS1650Y)
Optional +5% V
CC
operating range (DS1650AB)
Optional
industrial temperature range of -40
o
C to
o
C, designated IND
+85
NC
A15
A16
PFO
V
CC
WE
OE
CE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
GND
32-PIN ENCAPSULATED PACKAGE
740 MIL EXTENDED
JEDEC standard 32-pin DIP package
Low Profile Module (LPM) package
– Fits into standard 68–pin PLCC surface mount-
able socket
– 255 mils package height
– Power Fail Output (PFO) warns system of
impending V
CC
power failure
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
34–PIN LOW PROFILE MODULE (LPM)
A18
A17
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
ECopyright
1995 by Dallas Semiconductor Corporation.
All Rights Reserved. For important information regarding
patents and other intellectual property rights, please refer to
Dallas Semiconductor data books.
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