EEWORLDEEWORLDEEWORLD

Part Number

Search

S2512CUG123K30-TR

Description
Fixed Resistor, Metal Glaze/thick Film, 1.5W, 12000ohm, 200V, 10% +/-Tol, 300ppm/Cel, Surface Mount, 2512, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size123KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance  
Download Datasheet Parametric View All

S2512CUG123K30-TR Overview

Fixed Resistor, Metal Glaze/thick Film, 1.5W, 12000ohm, 200V, 10% +/-Tol, 300ppm/Cel, Surface Mount, 2512, CHIP, ROHS COMPLIANT

S2512CUG123K30-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerState of the Art Inc.
package instructionCHIP, ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
JESD-609 codee4
Manufacturer's serial numberS2512
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.58 mm
Package length6.35 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width3.02 mm
method of packingTR
Rated power dissipation(P)1.5 W
Rated temperature70 °C
resistance12000 Ω
Resistor typeFIXED RESISTOR
series2512(STD)-THICK FILM
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance10%
Operating Voltage200 V
2512 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
TEMPERATURE RISE (°C)
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
44.5°C/W
1500 mW
200 Volts
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 2512 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.300
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.250 (.250 - .258)
.119 (.119 - .125)
.028 (.023 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.212 (.208 - .216)
.0513 grams
6.35
3.02
0.71
0.51
0.48
5.39
(6.35 - 6.55)
(3.02 - 3.18)
(0.58 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(5.28 - 5.49)
.125
.202
.049
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08
sockit custom kernel USB disk cannot be recognized
Please ask a question. I use a sockit development board. I follow the tutorial and use the socfpga_3.9_rel kernel to generate a zimage file. After downloading it to the board, plugging in the USB hub ...
AD_DA FPGA/CPLD
Last three days! Qinheng CH579 free evaluation! BLE, Ethernet, LCD, full-speed USB, ADC, touch... Let's play~
Low-power Bluetooth BLE communication module, Ethernet controller and transceiver, full-speed USB host and device controller and transceiver, segment LCD driver module, ADC, touch button detection mod...
okhxyyo Domestic Chip Exchange
The latest DSP interface program (VB version)
The latest DSP interface program (VB version)...
maker MCU
The WinCE 5.0 standard simulator does not have a soft keyboard module. Can this module be added to the simulator?
If you can join, please talk about the specific method. I want to use this function SipShowIM(SIPF_OFF) in the simulator. If the simulator does not have a soft keyboard module, using this function can...
jjnature Embedded System
The reason why the distance of zstack joining the network is less than the actual communication distance
Often, it is found that the effective distance of CC2530 running zstack to join the network is smaller than the distance that can communicate. Why is this?After checking the code, I found the reason.W...
kata RF/Wirelessly
China Embedded System Industry Alliance solicits invitation letter for individual members
China Embedded System Industry Alliance (hereinafter referred to as China Embedded Alliance) is a non-independent corporate social organization spontaneously established by enterprises and institution...
likyo Robotics Development

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2077  1068  1839  653  2488  42  22  38  14  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号