EEWORLDEEWORLDEEWORLD

Part Number

Search

MN5245E

Description
ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40
CategoryAnalog mixed-signal IC    converter   
File Size848KB,9 Pages
ManufacturerSpectrum Microwave
Download Datasheet Parametric Compare View All

MN5245E Overview

ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40

MN5245E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSpectrum Microwave
Parts packaging codeDIP
package instructionDIP, DIP40,.6
Contacts40
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum analog input voltage6 V
Minimum analog input voltage-1 V
Maximum conversion time0.85 µs
Converter typeADC, FLASH METHOD
JESD-30 codeR-CDIP-T40
JESD-609 codee0
length53.215 mm
Maximum linear error (EL)0.024%
Nominal negative supply voltage-15 V
Number of digits12
Number of functions1
Number of terminals40
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Output bit codeBINARY, OFFSET BINARY
Output formatPARALLEL, 8 BITS
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5,+-15 V
Certification statusNot Qualified
Sampling rate1.1 MHz
Maximum seat height5.512 mm
Maximum slew rate165 mA
Nominal supply voltage15 V
surface mountNO
technologyHYBRID
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

MN5245E Related Products

MN5245E MN5246H/B MN5246H/BCH MN5246E MN5246H MN5245H/BCH MN5245H/B MN5246 MN5245 MN5245H
Description ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 ADC, Flash Method, 12-Bit, 1 Func, Parallel, 8 Bits Access, Hybrid, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave
Parts packaging code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
package instruction DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6
Contacts 40 40 40 40 40 40 40 40 40 40
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 3A001.A.2.C 3A001.A.2.C EAR99 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C EAR99 EAR99 3A001.A.2.C
Maximum analog input voltage 6 V 3.5 V 3.5 V 3.5 V 3.5 V 6 V 6 V 3.5 V 6 V 6 V
Minimum analog input voltage -1 V -3.5 V -3.5 V -3.5 V -3.5 V -1 V -1 V -3.5 V -1 V -1 V
Maximum conversion time 0.85 µs 0.85 µs 0.85 µs 0.85 µs 0.85 µs 0.85 µs 0.85 µs 0.85 µs 0.85 µs 0.85 µs
Converter type ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD
JESD-30 code R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 53.215 mm 53.215 mm 53.215 mm 53.215 mm 53.215 mm 53.215 mm 53.215 mm 53.215 mm 53.215 mm 53.215 mm
Maximum linear error (EL) 0.024% 0.024% 0.024% 0.024% 0.024% 0.024% 0.024% 0.024% 0.024% 0.024%
Nominal negative supply voltage -15 V -15 V -15 V -15 V -15 V -15 V -15 V -15 V -15 V -15 V
Number of digits 12 12 12 12 12 12 12 12 12 12
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 40 40 40 40 40 40 40 40 40 40
Maximum operating temperature 85 °C 125 °C 125 °C 85 °C 125 °C 125 °C 125 °C 70 °C 70 °C 125 °C
Minimum operating temperature -25 °C -55 °C -55 °C -25 °C -55 °C -55 °C -55 °C - - -55 °C
Output bit code BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY
Output format PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Sampling rate 1.1 MHz 1.1 MHz 1.1 MHz 1.1 MHz 1.1 MHz 1.1 MHz 1.1 MHz 1.1 MHz 1.1 MHz 1.1 MHz
Maximum seat height 5.512 mm 5.512 mm 5.512 mm 5.512 mm 5.512 mm 5.512 mm 5.512 mm 5.512 mm 5.512 mm 5.512 mm
Maximum slew rate 165 mA 165 mA 165 mA 165 mA 165 mA 165 mA 165 mA 165 mA 165 mA 165 mA
Nominal supply voltage 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID
Temperature level OTHER MILITARY MILITARY OTHER MILITARY MILITARY MILITARY COMMERCIAL COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
What is the difference between a function call and a callback?
What is the difference between calling a function and calling a callback?...
yhye2world stm32/stm8
Encryption IC
Encryption IC protects your software and prevents others from copying it. Introduction to the product: It adopts a dedicated hardware platform for smart cards, with an embedded system independently de...
jakey0225 Embedded System
555 timer frequency drift problem
[i=s]This post was last edited by S3S4S5S6 on 2022-8-13 20:22[/i]Manual circuit diagram and calculation formulaThe actual parameters given are as follows After actually building the circuit and testin...
S3S4S5S6 Analog electronics
What should I pay attention to when making a boost circuit for a battery (without using a chip)?
I am currently working on a portable device that requires a 3V battery to be boosted to 9V to power the system. The requirement is to build it yourself using discrete components and control it with MC...
sfcsdc Analog electronics
DSP video tutorial (University of Electronic Science and Technology of China)
[size=13.5pt][font=宋体]Chapter 1 briefly discusses the basic ideas and advantages of digital signal processing. [/font][/size] [size=13.5pt][font=宋体]Chapter 2 introduces the latest developments of DSP ...
676797119 DSP and ARM Processors
Perpetual Calendar Designed with Single Chip Microcomputer and FPGA
This is a senior's graduation project. Now I'm sending it to everyone....
qixiangyujj MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2543  2154  369  1379  2850  52  44  8  28  58 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号