X20C17DM-35 datasheet, PDF - EEWORLD Datasheet

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X20C17DM-35: DescriptionNon-Volatile SRAM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24; Categorystorage storage; File Size242KB，10 Pages; ManufacturerXicor Inc.

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X20C17DM-35 Overview

Non-Volatile SRAM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24

X20C17DM-35 Parametric

Parameter Name	Attribute value
Maker	Xicor Inc.
package instruction	HERMETIC SEALED, CERDIP-24
Reach Compliance Code	unknown
Maximum access time	35 ns
Other features	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES
JESD-30 code	R-GDIP-T24
memory density	16384 bit
Memory IC Type	NON-VOLATILE SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL

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X20C17DM-35 Related Products

	X20C17DM-35	X20C17D-35	X20C17DM-55	X20C17DM-45	X20C17DI-55	X20C17DI-45	X20C17DI-35	X20C17D-45
Description	Non-Volatile SRAM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24	Non-Volatile SRAM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24	Non-Volatile SRAM, 2KX8, 55ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24	Non-Volatile SRAM, 2KX8, 45ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24	Non-Volatile SRAM, 2KX8, 55ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24	Non-Volatile SRAM, 2KX8, 45ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24	Non-Volatile SRAM, 2KX8, 35ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24	Non-Volatile SRAM, 2KX8, 45ns, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24
Maker	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.
package instruction	HERMETIC SEALED, CERDIP-24	HERMETIC SEALED, CERDIP-24	HERMETIC SEALED, CERDIP-24	HERMETIC SEALED, CERDIP-24	HERMETIC SEALED, CERDIP-24	HERMETIC SEALED, CERDIP-24	HERMETIC SEALED, CERDIP-24	HERMETIC SEALED, CERDIP-24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	35 ns	35 ns	55 ns	45 ns	55 ns	45 ns	35 ns	45 ns
Other features	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES	RETENTION/ENDURANCE=100 YEARS/100000 CYCLES
JESD-30 code	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	125 °C	125 °C	85 °C	85 °C	85 °C	70 °C
Minimum operating temperature	-55 °C	-	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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