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TS(X)PC860MHVG50A3

Description
Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size4MB,95 Pages
Manufacturere2v technologies
Download Datasheet Parametric View All

TS(X)PC860MHVG50A3 Overview

Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357

TS(X)PC860MHVG50A3 Parametric

Parameter NameAttribute value
Makere2v technologies
Parts packaging codeBGA
package instruction,
Contacts357
Reach Compliance Codeunknown
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency50 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B357
low power modeNO
Number of terminals357
Maximum operating temperature110 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
speed50 MHz
Maximum supply voltage3.465 V
Minimum supply voltage3.135 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal locationBOTTOM
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
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