FIFO, 64X4, Asynchronous, MOS, PDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Msis Semiconductor Inc |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Maximum clock frequency (fCLK) | 1 MHz |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| Number of terminals | 16 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64X4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.045 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| AM2841PC | AM2841APC | AM2841ADC | |
|---|---|---|---|
| Description | FIFO, 64X4, Asynchronous, MOS, PDIP16 | FIFO, 64X4, Asynchronous, MOS, PDIP16 | FIFO, 64X4, Asynchronous, MOS, CDIP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Msis Semiconductor Inc | Msis Semiconductor Inc | Msis Semiconductor Inc |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum clock frequency (fCLK) | 1 MHz | 1.2 MHz | 1.2 MHz |
| JESD-30 code | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 4 | 4 | 4 |
| Number of terminals | 16 | 16 | 16 |
| word count | 64 words | 64 words | 64 words |
| character code | 64 | 64 | 64 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 64X4 | 64X4 | 64X4 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.045 mA | 0.045 mA | 0.045 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
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