IC,SRAM,16X4,ECL/TTL,DIP,28PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | compliant |
| Maximum access time | 55 ns |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of terminals | 28 |
| word count | 16 words |
| character code | 16 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16X4 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | ECL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| IDM29705JM | IDM29705AJC | IDM29705AJM | IDM29705AJM/883 | IDM29705ANC | IDM29705JC | IDM29705JM/883 | |
|---|---|---|---|---|---|---|---|
| Description | IC,SRAM,16X4,ECL/TTL,DIP,28PIN,CERAMIC | IC,SRAM,16X4,ECL/TTL,DIP,28PIN,CERAMIC | IC,SRAM,16X4,ECL/TTL,DIP,28PIN,CERAMIC | IC,SRAM,16X4,ECL/TTL,DIP,28PIN,CERAMIC | IC,SRAM,16X4,ECL/TTL,DIP,28PIN,PLASTIC | IC,SRAM,16X4,ECL/TTL,DIP,28PIN,CERAMIC | IC,SRAM,16X4,ECL/TTL,DIP,28PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | compliant |
| Maximum access time | 55 ns | 25 ns | 30 ns | 30 ns | 25 ns | 50 ns | 55 ns |
| JESD-30 code | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 | R-XDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| character code | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C | - | - | -55 °C |
| organize | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | ECL | ECL | ECL | ECL | ECL | ECL | ECL |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
京公网安备 11010802033920号
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