SpecNo.JELF243A-0030T-01
Reference Only
P1/8
CHIP COIL (CHIP INDUCTORS) LQH32CN□□□□53L REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQH32CN_53 Series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
H
32
C
N
1R0
M
5
3
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3. Rating
・Operating
Temperature Range.
・Storage
Temperature Range.
Customer
Part Number
MURATA
Part Number
-40
to
+85°C
-40
to
+85°C
Inductance
(µH)
Tolerance
DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min)
∗Rated
Current
(mA)
LQH32CN1R0M53L
LQH32CN2R2M53L
LQH32CN3R3M53L
LQH32CN4R7M53L
LQH32CN6R8M53L
LQH32CN100K53L
LQH32CN150K53L
LQH32CN220K53L
LQH32CN330K53L
LQH32CN470K53L
LQH32CN680K53L
LQH32CN101K53L
1.0
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
±10%
±20%
0.060±30%
0.097±30%
0.12 ±30%
0.15 ±30%
0.25 ±30%
0.30 ±30%
0.58 ±30%
0.71 ±30%
1.1
1.3
2.2
3.5
±30%
±30%
±30%
±30%
100
64
50
43
32
26
26
19
17
15
12
10
1000
790
710
650
540
450
300
250
200
170
130
100
∗When
applied Rated current to the Products , self temperature rise shall be limited to 20
℃
max and
Inductance will be within ±10% of initial Inductance value.
4. Testing Conditions
<Unless otherwise specified>
Temperature : Ordinary Temperature (15 to 35°C)
Humidity
: Ordinary Humidity (25 to 85 %(RH))
<In case of doubt>
Temperature
: 20 ± 2°C
Humidity
: 60 to 70%(RH)
Atmospheric Pressure : 86 to 106 kPa
5. Appearance and Dimensions
2.5 ± 0.2
1.55 ± 0.15
2.5 ± 0.2
A
A
2.5 ± 0.2
3.2 ± 0.3
A : 2.8 max.
※
No marking.
■Unit
Mass (Typical value)
0.045½
(in mm)
0.9 ± 0.31.3 ± 0.2 0.9 ± 0.3
MURATA MFG.CO., LTD
SpecNo.JELF243A-0030T-01
Reference Only
Specification
Inductance shall meet item 3.
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
P2/8
6.Electrical Performance
No.
6.1
6.2
6.3
Item
Inductance
DC Resistance
Self Resonant
Frequency
(S.R.F)
Test Method
Measuring Equipment : KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
Measuring Equipment: Digital multi meter
Measuring Equipment: KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged.
Test Method
Substrate: Glass-epoxy substrate
Applied Direction :
Chip coil
Ｆ
Substrate
Force: 10N
Hold Duration: 5±1s
7.2
Bending Test
Substrate:Glass-epoxy substrate
(100×40×1.6mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30seconds.
Pressure jig
R340
F
Deflection
45
45
Product
(in mm)
7.3
Vibration
Oscillation Frequency : 10~55~10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time: A period of 2 hours in each of 3
mutually perpendicular directions.
(Total 6 hours)
The wetting area of the electrode shall
be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 240±5°C
Immersion Time : 3±1 s
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition
for 24±2 hours.
7.4
Solderability
7.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
MURATA MFG.CO., LTD
SpecNo.JELF243A-0030T-01
Reference Only
Specification
Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change: within ± 5%
P3/8
8.Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
Test Method
Temperature: 85±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: -40±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step: Ordinary temp. / 10 to 15 minutes
3 step: +85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
φ
1.5
-0
※
Lead- in/out wire
1.75±0.1
(
0.2
)
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
Dimension of the Cavity is measured
at the bottom side.
(in mm)
3.5±0.05
3.6±0.2
4.0±0.1
2.9±0.2
4.0±0.1
1.7±0.2
2.0±0.05
Direction of feed
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
MURATA MFG.CO., LTD
8.0±0.2
SpecNo.JELF243A-0030T-01
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
Reference Only
300mm/min
0.2 to 0.7N
(minimum value is typical)
Plastic tape
165 to 180 degree
F
Cover tape
P4/8
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer
2.0±0.5
160 min.
Leader
Label
190 min.
Empty tape
φ
13.0±0.2
210 min.
Cover tape
1
φ
60±
0
9±
1
0
13±1.4
φ
180±
3
0
φ
21.0±0.8
Direction of feed
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc
½½½
∗1)
<Expression of Inspection No.>
(1) Factory Code
(2) Date
(3) Serial No.
∗2)
« Expression of RoHS marking »
(1) RoHS regulation conformity
(2) MURATA classification number
ROHS – Y (△)
(1) (2)
□□
OOOO
×××
(1)
(2)
(3
)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,
Quantity, etc
½½½
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Label
H
D
W
W
186
D
186
H
93
Standard Reel Quantity
in Outer Case (Reel)
5
∗Above
Outer Case size is typical. It depends on a quantity of an order.
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
MURATA MFG.CO., LTD
SpecNo.JELF243A-0030T-01
Reference Only
P5/8
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Flow Soldering
5.5
Reflow Soldering
∗
Chip Coil
5.5
Land
Solder Resist
2.0
1.0
1.0
1.3
1.0
1.3
1.0
(in mm)
∗
Applicable to flow soldering.
11.2 Flux, Solder
・Use
rosin-based flux.
Flux
・Don’t
use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t
use water-soluble flux.
・Use
Sn-3.0Ag-0.5Cu solder.
Solder
・Standard
thickness of solder paste : 200μm to 300μm
11.3 Flow soldering conditions / Reflow soldering conditions
・Pre-heating
should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard
soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
Soldering profile
(1)Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(s)
Pre-heating
Heating
Cycle of flow
Standard Profile
Limit Profile
150℃、60s min.
250℃、4s½6s
265
℃
±3
℃、5s
2 times
1 time
MURATA MFG.CO., LTD
京公网安备 11010802033920号
EEWORLD
