BGA Heat Sink (High Aspect Ratio Ext.)
Straight Fin
ATS Part#:
Description:
ATS045045022-SF-15U
45.00 x 45.00 x 22.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin
Heat Sink Type:
Heat Sink Attachment:
Equivalent Part Number:
Straight Fin
superGRIP
N/A
*Image above is for illustration purpose only.
Features & Benefits
High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments
Features a low profile, slant fin array that offers many of the performance benefits of
maxiFLOW™
at a great value
Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks
Comes standard without interface material or with most common pressure sensitive thermal tapes as a custom option
Thermal Performance
AIR VELOCITY
@200 LFM
1.0 M/S
Unducted Flow
THERMAL RESISTANCE
Ducted Flow
1
0.8
0.7
0.7
0.6
0.6
0.5
2.68 °C/W
@300 LFM
1.5 M/S
1.6 °C/W
@400 LFM
2.0 M/S
1.2 °C/W
@500 LFM
2.5 M/S
1 °C/W
@600 LFM
3.0 M/S
0.9 °C/W
@700 LFM
3.5 M/S
0.8 °C/W
@800 LFM
4.0 M/S
0.7 °C/W
Product Detail
Schematic Image
Dimension A
45.00 mm
Dimension B
45.00 mm
Dimension C
22.00 mm
Dimension D
45 mm
TIM
N/A
Finish
BLACK-ANODIZED
Notes:
Dimension
A
and
B
refer to component size.
Dimension
C
is the heat sink height from the bottom of the base to the top of the fin field.
Dimension
D
is fin tip to fin tip.
Thermal performance data are provided for reference only. Actual performance may vary by
application.
ATS reserves the right to update or change its products without notice to improve the design or
performance.
ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
Contact ATS to learn about custom options available.
*Image above is for illustration purpose only.
For more information, to find a distributor or to place an order, please contact us at
781-769-2800 (North America),
sales@qats.com
or
www.qats.com.
© 2013 Advanced Thermal Solutions, Inc.
| 89-27 Access Road | Norwood MA | 02062 | USA
Rev - 050413
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
