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NAND Flash > SLC-large block > K9KAG08U0M
package & packing
production & availability
RoHS information
The data
sheet of this product is either in preparation or is not effective yet.
For more details about product specifications or technical files, please inquire through
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package & packing
K9KAG08U0M-
PCB00
TSOP1
Tray
48
12.0X20.0
K9KAG08U0M-
PCB0
Lead Free
K9KAG08U0M-
PCB0T
TSOP1
Tape & Reel
48
12.0X20.0
K9KAG08U0M-
PCB0
Lead Free
K9KAG08U0M-
PCK00
TSOP1
Tray
48
12.0X20.0
K9KAG08U0M-
PCK0
Lead Free
K9KAG08U0M-
PIB00
TSOP1
Tray
48
12.0X20.0
K9KAG08U0M-
PIB0
Lead Free
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related docum ent
device ID table
part number decoder
related link
Flash application notes
label & code information
packing information
package information
production & availability
part num ber
life cycle
die revision
MOQ (sm all box)
MOQ (large box)
qual sam ple
m ass production
last tim e buy
last tim e ship
replacem ent part
num ber
K9KAG08U0M-
PCB00
PRODUCTION
N/A
960
3840
N/A
N/A
N/A
N/A
N/A
1000
5000
N/A
N/A
N/A
N/A
K9KAG08U0M-
PCB0T
K9KAG08U0M-
PCK00
PRODUCTION
N/A
960
3840
N/A
N/A
N/A
N/A
K9KAG08U0M-
PIB00
PRODUCTION
N/A
960
3840
N/A
N/A
N/A
N/A
memory brochures
[note]
Life cycle identifies the device's overall life expectancy as being either
emerging, production,
or EOL(life
cycle is independent of and does not correspond to die version).
Die revision identifies the die version's production status as being either
under development, transitioning
In, mass production, transitioning out, or old version.
Replacement part number is a recommended SAMSUNG part number for replacing EOL or old version
devices.
RoHS information
For more information, please click the button next to the product name.
material declaration sheet
does not contain hazardous materials defined in
China RoHS
declaration letter
contains hazardous materials defined in
China RoHS
K9KAG08U0M-PCB00
is Lead-free and RoHS-compliant.
K9KAG08U0M-PCB0T
is Lead-free and RoHS-compliant.
K9KAG08U0M-PCK00
is Lead-free and RoHS-compliant.
K9KAG08U0M-PIB00
is Lead-free and RoHS-compliant.
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