EEWORLDEEWORLDEEWORLD

Part Number

Search

MN5904E

Description
ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16
CategoryAnalog mixed-signal IC    converter   
File Size343KB,6 Pages
ManufacturerSpectrum Microwave
Download Datasheet Parametric Compare View All

MN5904E Overview

ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16

MN5904E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSpectrum Microwave
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum analog input voltage2.5 V
Minimum analog input voltage-3.5 V
Maximum conversion time0.013 µs
Converter typeADC, FLASH METHOD
JESD-30 codeR-CDIP-T16
JESD-609 codee0
length20.25 mm
Maximum linear error (EL)0.8%
Nominal negative supply voltage-5.2 V
Number of digits6
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output bit codeOFFSET BINARY, COMPLEMENTARY OFFSET BINARY
Output formatPARALLEL, WORD
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5,-5.2 V
Certification statusNot Qualified
Sampling rate100 MHz
Maximum seat height4.6 mm
Maximum slew rate80 mA
Nominal supply voltage5 V
surface mountNO
technologyBIPOLAR
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

MN5904E Related Products

MN5904E MN5905E MN5905 MN5905H MN5904H MN5904
Description ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16 ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16 ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16 ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16 ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16 ADC, Flash Method, 6-Bit, 1 Func, Parallel, Word Access, Bipolar, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave Spectrum Microwave
Parts packaging code DIP DIP DIP DIP DIP DIP
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Contacts 16 16 16 16 16 16
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 3A001.A.2.C 3A001.A.2.C EAR99
Maximum analog input voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Minimum analog input voltage -3.5 V -3.5 V -3.5 V -3.5 V -3.5 V -3.5 V
Maximum conversion time 0.013 µs 0.013 µs 0.013 µs 0.013 µs 0.013 µs 0.013 µs
Converter type ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD ADC, FLASH METHOD
JESD-30 code R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 R-CDIP-T16
JESD-609 code e0 e0 e0 e0 e0 e0
length 20.25 mm 20.25 mm 20.25 mm 20.25 mm 20.25 mm 20.25 mm
Maximum linear error (EL) 0.8% 0.8% 0.8% 0.8% 0.8% 0.8%
Nominal negative supply voltage -5.2 V -5.2 V -5.2 V -5.2 V -5.2 V -5.2 V
Number of digits 6 6 6 6 6 6
Number of functions 1 1 1 1 1 1
Number of terminals 16 16 16 16 16 16
Maximum operating temperature 85 °C 85 °C 70 °C 125 °C 125 °C 70 °C
Minimum operating temperature -40 °C -40 °C - -55 °C -55 °C -
Output bit code OFFSET BINARY, COMPLEMENTARY OFFSET BINARY OFFSET BINARY, COMPLEMENTARY OFFSET BINARY OFFSET BINARY, COMPLEMENTARY OFFSET BINARY OFFSET BINARY, COMPLEMENTARY OFFSET BINARY OFFSET BINARY, COMPLEMENTARY OFFSET BINARY OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
Output format PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Sampling rate 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
Maximum seat height 4.6 mm 4.6 mm 4.6 mm 4.6 mm 4.6 mm 4.6 mm
Maximum slew rate 80 mA 80 mA 80 mA 80 mA 80 mA 80 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
Which big brother can come in and help take a look?
What is the difference between x=x*8 and x=x<<3?...
amork2007 Embedded System
Important operations in circuit PCB design in EDA
Start the PCB editor → determine the size of the circuit board → load the package component library → load the network table 9 component layout and routing → automatic/manual routing → view the 3D vie...
ESD技术咨询 PCB Design
Learning about NXP1768CAN module
I am learning the CAN module of NXP1768. Can an expert teach me how to get started quickly? ? Thank you very much!!...
panzhenlkj NXP MCU
Several issues about switching power supply
[align=left][font=仿宋_GB2312][size=12.0pt]1.[/size][/font][color=#FF6600][font=仿宋_GB2312][size=12.0pt]Solution to no-load oscillation[/size][/font][/color][/align][align=left][font=仿宋_GB2312][size=12.0...
qwqwqw2088 Power technology
2011 National Championship Prediction Questions
[i=s]This post was last edited by paulhyde on 2014-9-15 09:45[/i] [local]1[/local]...
15280717502 Electronics Design Contest
Standardization and internationalization of reset circuits
Standardization and internationalization of reset circuits...
linda_xia Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1103  1432  18  287  892  23  29  1  6  18 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号