Philips Semiconductors
Product specification
Low power single card reader
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.3
8.3.1
8.3.2
8.4
8.4.1
8.4.2
8.4.3
8.5
8.6
8.6.1
8.7
8.8
8.9
8.10
8.10.1
8.10.1.1
8.10.1.2
8.10.1.3
8.10.1.4
FEATURES
GENERAL DESCRIPTION
APPLICATIONS
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Microcontroller
Port characteristics
Oscillator characteristics
Reset
Low power modes
Timer 2 operation
Timer/counter 2 Control register (T2CON)
Timer/counter 2 Mode control register
(T2MOD)
Auto-reload mode (up- or down-counter)
Baud rate generator mode
Timer/counter 2 set-up
Enhanced UART
Serial port Control register (SCON)
Automatic address recognition
Interrupt priority structure
Interrupt Enable (IE) register
Interrupt Priority (IP) register
Interrupt Priority High (IPH) register
Dual Data Pointer (DPTR)
Expanded data RAM addressing
Auxiliary Register (AUXR)
Reduced EMI mode
Mask ROM devices
ROM code submission for 16 kbytes ROM
device TDA8029
Smart card reader control registers
General registers
Card Select Register (CSR)
Hardware Status Register (HSR)
Time-Out Registers (TOR1, TOR2 and TOR3)
Time-Out Configuration register (TOC)
8.10.2
8.10.2.1
8.10.2.2
8.10.2.3
8.10.2.4
8.10.2.5
8.10.3
8.10.3.1
8.10.3.2
8.10.3.3
8.10.3.4
8.10.3.5
8.10.3.6
8.10.4
8.11
8.12
8.13
8.14
8.15
8.16
8.17
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
TDA8029
ISO UART registers
UART Transmit Register (UTR)
UART Receive Register (URR)
Mixed Status Register (MSR)
FIFO Control Register (FCR)
UART Status Register (USR)
Card registers
Programmable Divider Register (PDR)
UART Configuration Register 2 (UCR2)
Guard Time Register (GTR)
UART Configuration Register 1 (UCR1)
Clock Configuration Register (CCR)
Power Control Register (PCR)
Register summary
Supply
DC/DC converter
ISO 7816 security
Protections and limitations
Power reduction modes
Activation sequence
Deactivation sequence
LIMITING VALUES
HANDLING
THERMAL CHARACTERISTICS
CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2003 Oct 30
2
Philips Semiconductors
Product specification
Low power single card reader
1
FEATURES
TDA8029
•
Supports synchronous cards which do not use C4/C8
•
Current limitations on card contacts
•
Supply supervisor for power-on/off reset and spikes
killing
•
DC/DC converter (supply voltage from 2.7 to 6 V),
doubler, tripler or follower according to V
CC
and V
DD
•
Shut-down input for very low power consumption
•
Enhanced ESD protection on card contacts (6 kV
minimum)
•
Software library for easy integration
•
Communication with the host through a standard full
duplex serial link at programmable baud rates
•
One external interrupt input and four general purpose
I/Os.
2
GENERAL DESCRIPTION
•
80C51 core with 16 kbytes ROM, 256 bytes RAM and
512 bytes XRAM
•
Specific ISO7816 UART, accessible with MOVX
instructions for automatic convention processing,
variable baud rate, error management at character level
for T = 0 and T = 1 protocols, extra guard time, etc.
•
Specific versatile 24-bit Elementary Time Unit (ETU)
counter for timing processing during Answer To Reset
(ATR) and for T = 1 protocol
•
V
CC
generation (5 V
±
5 % or 3 V
±
5 % or 1.8 V),
maximum current 65 mA with controlled rise and fall
times
•
Card clock generation up to 20 MHz with three times
synchronous frequency doubling (f
XTAL
,
1
/
2
f
XTAL
,
1
/
4
f
XTAL
and
1
/
8
f
XTAL
)
•
Card clock stop HIGH or LOW or 1.25 MHz from an
integrated oscillator for card power reduction modes
•
Automatic activation and deactivation sequences
through an independant sequencer
•
Supports asynchronous protocols T = 0 and T = 1 in
accordance with:
– ISO 7816 and EMV 3.1.1 (TDA8029HL/C1 and
TDA8029HL/C2)
– ISO 7816 and EMV 2000 (TDA8029HL/C2).
•
1 to 8 characters FIFO in reception mode
•
Parity error counter in reception mode and in
transmission mode with automatic retransmission
•
Versatile 24-bit time-out counter for ATR and waiting
times processing
•
Specific ETU counter for Block Guard Time (BGT)
(22 ETU in T = 1 and 16 ETU in T = 0)
•
Minimum delay between two characters in reception
mode:
– In protocol T = 0:
12 ETU (TDA8029HL/C1)
11.8 ETU (TDA8029HL/C2).
– In protocol T = 1:
11 ETU (TDA8029HL/C1)
10.8 ETU (TDA8029HL/C2).
The TDA8029 is a complete one chip, low cost, low power,
robust smart card reader. Its different power reduction
modes and its wide supply voltage range allow its use in
portable equipment. Due to specific versatile hardware, a
small embedded software program allows the control of
most cards available in the market. The control from the
host may be done through a standard serial interface.
The TDA8029 may be delivered with standard embedded
software, or be masked with specific customer code. For
details on software development and on available tools,
please refer to application notes
“AN01009”
and
“AN10134”
for the TDA8029HL/C1. For standard
embedded software, please refer to application note
“AN10206”
for the TDA8029HL/C2.
3
APPLICATIONS
•
Portable card readers
•
General purpose card readers
•
EMV compliant card readers.
2003 Oct 30
3
Philips Semiconductors
Product specification
Low power single card reader
4
QUICK REFERENCE DATA
SYMBOL
V
DD
V
DCIN
I
DD(sd)
I
DD(pd)
PARAMETER
supply voltage
input voltage for the DC/DC
converter
supply current in shut-down
mode
supply current in Power-down
mode
supply current in Sleep mode
V
DD
= 3.3 V
V
DD
= 3.3 V; card inactive;
microcontroller in Power-down
mode
V
DD
= 3.3 V; card active at
V
CC
= 5 V; clock stopped;
microcontroller in Power-down
mode; I
CC
= 0
µA
I
CC
= 65 mA; f
XTAL
= 20 MHz;
f
CLK
= 10 MHz; 5 V card;
V
DD
= 2.7 V
active mode including static
loads; I
CC
< 65 mA; 5 V card
active mode; current pulses of
40 nAs with I < 200 mA,
t < 400 ns, f < 20 MHz; 5 V card
active mode including static
loads; I
CC
< 65 mA; V
DD
> 3.0 V;
3 V card
active mode; current pulses of
24 nAs with I < 200 mA,
t < 400 ns, f < 20 MHz; 3 V card
active mode including static
loads; I
CC
< 30 mA; 1.8 V card
active mode; current pulses of
12 nAs with I < 200 mA,
t < 400 ns, f < 20 MHz;
1.8 V card
I
CC
card supply current
5 V card; V
CC
= 0 to 5 V
3 V card; V
CC
= 0 to 3 V;
V
DD
> 3.0 V
1.8 V card; V
CC
= 0 to 1.8 V
I
CC(det)
SR
r
, SR
f
t
de
t
act
f
XTAL
T
amb
2003 Oct 30
overload detection current
rise and fall slew rate on V
CC
deactivation sequence
duration
activation sequence duration
crystal frequency
ambient temperature
4
V
DD
= 5 V
V
DD
< 3 V
maximum load capacitor 300 nF
CONDITIONS
MIN.
2.7
V
DD
−
−
−
−
−
−
TYP.
TDA8029
MAX.
6.0
6.0
20
110
UNIT
V
V
µA
µA
I
DD(sl)
−
−
675
µA
I
DD(om)
supply current in operating
mode
card supply voltage
−
−
250
mA
V
CC
4.75
4.6
5.0
−
5.25
5.4
V
V
2.78
3
3.22
V
2.75
−
3.25
V
1.62
1.62
1.8
−
1.98
1.98
V
V
−
−
−
−
0.05
−
−
4
4
−40
−
−
−
100
0.16
−
−
−
−
−
65
65
30
−
0.22
100
130
27
16
+90
mA
mA
mA
mA
V/µs
µs
µs
MHz
MHz
°C
Embedded System
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