c. Maximum under steady state conditions is 80 °C/W.
d. Based on T
C
= 25 °C.
PCB Mount
b
SYMBOL
R
thJA
R
thJF
LIMIT
85
22
UNIT
°C/W
1
www.din-tek.jp
SPECIFICATIONS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
V
DS
V
GS(th)
I
GSS
I
DSS
I
D(on)
V
GS
= 0, I
D
= - 250 μA
V
DS
= V
GS
, I
D
= - 250 μA
V
DS
= 0 V, V
GS
= ± 20 V
V
GS
= 0 V
V
GS
= 0 V
V
GS
= 0 V
V
GS
= - 10 V
V
GS
= - 10 V
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V
V
GS
= - 10 V
V
GS
= - 4.5 V
Forward Transconductance
b
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
c
Gate-Source Charge
c
Gate-Drain
Charge
c
Gate Resistance
Turn-On Delay Time
c
Rise Time
c
Turn-Off Delay Time
c
Fall Time
c
Pulsed Current
a
Forward Voltage
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
I
SM
V
SD
I
F
= - 8 A, V
GS
= 0
V
DD
= - 15 V, R
L
= 15
I
D
- 1 A, V
GEN
= - 10 V, R
g
= 1
f = 1 MHz
V
GS
= - 10 V
V
DS
= - 15 V, I
D
= - 4.6 A
V
GS
= 0 V
V
DS
= - 15 V, f = 1 MHz
-
-
-
-
-
-
2
-
-
-
-
-
-
1736
392
268
38.3
5.9
9
-
12.5
9
45.3
10
-
- 0.84
2170
490
335
58
-
-
7
19
15
68
15
- 60
- 1.2
A
V
ns
nC
pF
g
fs
V
DS
= - 30 V
V
DS
= - 30 V, T
J
= 125 °C
V
DS
= - 30 V, T
J
= 175 °C
V
DS
-
5 V
I
D
= - 8 A
I
D
= - 8 A, T
J
= 125 °C
I
D
= - 8 A, T
J
= 175 °C
I
D
= - 6 A
- 30
- 1.5
-
-
-
-
- 30
-
-
-
-
-
-
- 2.0
-
-
-
-
-
0.013
-
-
0.016
22
-
- 2.5
± 100
-1
- 50
- 150
-
0.016
0.026
0.030
0.022
-
S
A
μA
V
nA
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
DTM4435
V
DS
= - 15 V, I
D
= - 8 A
Source-Drain Diode Ratings and Characteristics
b
Notes
a. Pulse test; pulse width
300 μs, duty cycle
2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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