d. Maximum under steady state conditions is 130 °C/W.
b, d
t
≤
5s
Steady State
Symbol
R
thJA
R
thJF
Typical
90
60
Maximum
115
75
Unit
°C/W
1
www.din-tek.jp
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 2.7 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 2.7 A, V
GS
=
0 V
0.8
10
5
6
4
T
C
= 25 °C
1.4
15
1.2
20
10
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 5.6
Ω
I
D
≅
2.7 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 15 V, R
L
= 5.6
Ω
I
D
≅
2.7 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
0.8
V
DS
= 15 V, V
GS
= 10 V, I
D
= 3.4 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 3.4 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
235
45
17
4.5
2.1
0.85
0.65
4.4
12
50
12
22
5
12
10
5
8.8
20
75
20
35
10
20
15
10
ns
Ω
6.7
3.2
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
=
10 V, I
D
= 3.2 A
V
GS
=
4.5 V, I
D
= 2.8 A
V
DS
= 15 V, I
D
= 4.8 A
10
0.049
0.051
11
0.058
0.065
1.2
30
31
-5
2.2
± 100
1
10
V
mV/°C
V
nA
µA
A
Ω
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
DTS3400
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2
TYPICAL CHARACTERISTICS
15
25 °C, unless otherwise noted
5
V
GS
= 10
V
thru 4
V
www.din-tek.jp
DTS3400
12
I
D
- Drain Current (A)
I
D
- Drain Current (A)
4
9
3
T
C
= - 55 °C
2
T
C
= 25 °C
1
T
C
= 125 °C
6
V
GS
= 3
V
3
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.10
300
Transfer Characteristics
R
DS(on)
- On-Resistance (Ω)
0.08
V
GS
= 4.5
V
0.06
V
GS
= 10
V
C - Capacitance (pF)
250
C
iss
200
150
0.04
100
C
oss
0.02
50
C
rss
0
5
10
15
20
25
30
0.00
0
3
6
9
12
15
0
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 3.4 A
V
GS
- Gate-to-Source
Voltage
(V)
8
V
DS
= 7.5
V
6
V
DS
= 24
V
4
V
DS
= 15
V
R
DS(on)
- On-Resistance
1.6
1.5
1.4
1.3
(Normalized)
1.2
1.1
1.0
0.9
0.8
0
0
1
2
3
4
5
0.7
- 50
I
D
= 3.2 A
Capacitance
V
GS
= 10
V
2
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
3
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.14
I
D
= 3.2 A
R
DS(on)
- On-Resistance (Ω)
0.12
I
S
- Source Current (A)
www.din-tek.jp
DTS3400
10
T
J
= 150 °C
0.10
T
J
= 25 °C
0.08
T
J
= 125 °C
1
0.06
T
J
= 25 °C
0.1
0.0
0.04
0.3
0.6
0.9
1.2
1.5
0
2
4
6
8
10
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
2.4
25
On-Resistance vs. Gate-to-Source Voltage
2.2
20
2.0
V
GS(th)
(V)
Power (W)
15
I
D
= 250
µA
1.8
10
1.6
5
1.4
1.2
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
I
D
- Drain Current (A)
10
100
µs
Single Pulse Power
1
1 ms
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.1
1
1 s, 10 s
DC
BVDSS Limited
10
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
4
TYPICAL CHARACTERISTICS
5
25 °C, unless otherwise noted
2.0
www.din-tek.jp
DTS3400
4
I
D
- Drain Current (A)
1.5
Package Limited
Power (W
3
1.0
2
0.5
1
0
0
25
50
75
100
125
150
0.0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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