Power Management Circuit, CDIP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Linfinity Microelectronics |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 4.5/40 V |
| Certification status | Not Qualified |
| Maximum supply current (Isup) | 7 mA |
| surface mount | NO |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| SG2542J | SG3542J | SG3542N | SG1542J | SG1542J/883B | SG1542J/883C | SG1542F/883B | SG1542F | SG3542D | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Power Management Circuit, CDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, PDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, CDFP14, | Power Management Circuit, CDFP14, | Power Management Circuit, PDSO14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-PDSO-G14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -25 °C | - | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DFP | DFP | SOP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | SOP14,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | SMALL OUTLINE |
| power supply | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply current (Isup) | 7 mA | 10 mA | 10 mA | 7 mA | 7 mA | 7 mA | 7 mA | 7 mA | 10 mA |
| surface mount | NO | NO | NO | NO | NO | NO | YES | YES | YES |
| Temperature level | OTHER | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Linfinity Microelectronics | - | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics |
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