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MT48LC16M16A2B4-6AAAT

Description
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, VFBGA-54
Categorystorage    storage   
File Size1MB,87 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
Download Datasheet Parametric View All

MT48LC16M16A2B4-6AAAT Overview

Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, VFBGA-54

MT48LC16M16A2B4-6AAAT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicron Technology
package instruction8 X 8 MM, LEAD FREE, VFBGA-54
Reach Compliance Codecompliant
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO REFRESH
JESD-30 codeS-PBGA-B54
length8 mm
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals54
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Filter levelAEC-Q100
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
256Mb: x4, x8, x16 Automotive SDRAM
Features
Automotive SDR SDRAM
MT48LC64M4A2 – 16 Meg x 4 x 4 banks
MT48LC32M8A2 – 8 Meg x 8 x 4 banks
MT48LC16M16A2 – 4 Meg x 16 x 4 banks
Features
• PC100- and PC133-compliant
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal, pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto precharge, includes concurrent auto precharge
and auto refresh modes
• Self refresh mode (not available on AAT devices)
• Auto refresh
– 64ms, 8192-cycle (commercial and industrial)
– 16ms, 8192-cycle (automotive)
• LVTTL-compatible inputs and outputs
• Single 3.3V ±0.3V power supply
• AEC-Q100
• PPAP submission
• 8D response time
Options
– 54-pin TSOP II OCPL
1
(400 mil)
Pb-free
– 60-ball FBGA (x4, x8) (8mm x 16mm)
– 60-ball FBGA (x4, x8) (8mm x 16mm)
Pb-free
– 54-ball VFBGA (x16) (8mm x 14 mm)
– 54-ball VFBGA (x16) (8mm x 14 mm)
Pb-free
– 54-ball VFBGA (x16) (8mm x 8 mm)
– 54-ball VFBGA (x16) (8mm x 8 mm)
Pb-free
Timing – cycle time
– 6ns @ CL = 3 (x8, x16 only)
– 7.5ns @ CL = 3 (PC133)
– 7.5ns @ CL = 2 (PC133)
Self refresh
– Standard
– Low power
Operating temperature range
– Industrial (–40˚C to +85˚C)
– Automotive (–40˚C to +105˚C)
Revision
Notes:
1.
2.
3.
4.
Off-center parting line.
Only available on Revision D.
Only available on Revision G.
Contact Micron for availability.
Marking
P
FB
BB
FG
2
BG
2
F4
3
B4
3
-6A
-75
-7E
None
L
4
AIT
AAT
4
:D/:G
Options
• Configurations
– 64 Meg x 4 (16 Meg x 4 x 4 banks)
– 32 Meg x 8 (8 Meg x 8 x 4 banks)
– 16 Meg x 16 (4 Meg x 16 x 4 banks)
• Write recovery (
t
WR)
t
WR = 2 CLK
• Plastic package – OCPL
1
– 54-pin TSOP II OCPL
1
(400 mil)
(standard)
Table 1: Key Timing Parameters
CL = CAS (READ) latency
Speed Grade
-6A
-7E
-75
-7E
-75
Clock
Frequency
167 MHz
143 MHz
133 MHz
133 MHz
100 MHz
Marking
64M4
32M8
16M16
A2
TG
Access Time
CL = 2
5.4ns
6ns
CL = 3
5.4ns
5.4ns
5.4ns
Setup Time
1.5ns
1.5ns
1.5ns
1.5ns
1.5ns
Hold Time
0.8ns
0.8ns
0.8ns
0.8ns
0.8ns
PDF: 09005aef848d99e8
256Mb_ait_aat_sdr_esg.pdf - Rev. C 1/14 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

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