MT48LC64M4A2BB-75 datasheet, PDF

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MT48LC64M4A2BB-75: DescriptionSynchronous DRAM, 64MX4, 5.4ns, CMOS, PBGA60, 8 X 16 MM, LEAD FREE, FBGA-60; Categorystorage storage; File Size2MB，92 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT48LC64M4A2BB-75 Overview

Synchronous DRAM, 64MX4, 5.4ns, CMOS, PBGA60, 8 X 16 MM, LEAD FREE, FBGA-60

MT48LC64M4A2BB-75 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	BGA
package instruction	TFBGA, BGA60,8X15,32
Contacts	60
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PBGA-B60
JESD-609 code	e1
length	16 mm
memory density	268435456 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	60
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA60,8X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.002 A
Maximum slew rate	0.27 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	8 mm

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256Mb: x4, x8, x16 SDRAM

Features

SDR SDRAM

MT48LC64M4A2 – 16 Meg x 4 x 4 banks

MT48LC32M8A2 – 8 Meg x 8 x 4 banks

MT48LC16M16A2 – 4 Meg x 16 x 4 banks

Features

•

PC100- and PC133-compliant

•

Fully synchronous; all signals registered on positive

edge of system clock

•

Internal, pipelined operation; column address can

be changed every clock cycle

•

Internal banks for hiding row access/precharge

•

Programmable burst lengths: 1, 2, 4, 8, or full page

•

Auto precharge, includes concurrent auto pre-

charge and auto refresh modes

•

Self refresh mode (not available on AT devices)

•

Auto refresh

–

64ms, 8192-cycle (commercial and industrial)

–

16ms, 8192-cycle (automotive)

•

LVTTL-compatible inputs and outputs

•

Single +3.3V ±0.3V power supply

Table 1: Address Table

Parameter

Configuration

Refresh count

Row addressing

Bank addressing

Column

addressing

64 Meg x 4 32 Meg x 8

16 Meg x 4

x 4 banks

8K A[12:0]

4 BA[1:0]

2K A[9:0],

A11

8 Meg x 8 x

4 banks

8K A[12:0]

4 BA[1:0]

1K A[9:0]

16 Meg

x 16

4 Meg x 16

x 4 banks

8K A[12:0]

4 BA[1:0]

512 A[8:0]

Options

•

Configurations

–

64 Meg x 4 (16 Meg x 4 x 4 banks)

–

32 Meg x 8 (8 Meg x 8 x 4 banks)

–

16 Meg x 16 (4 Meg x 16 x 4 banks)

•

Write recovery (

WR)

–

WR = 2 CLK

•

Plastic package – OCPL

–

54-pin TSOP II OCPL

(400 mil)

(standard)

–

54-pin TSOP II OCPL

(400 mil)

Pb-free

–

60-ball FBGA (x4, x8) (8mm x 16mm)

–

60-ball FBGA (x4, x8) (8mm x 16mm)

Pb-free

–

54-ball VFBGA (x16) (8mm x 14 mm)

–

54-ball VFBGA (x16) (8mm x 14 mm)

Pb-free

•

Timing – cycle time

–

6ns @ CL = 3 (x8, x16 only)

–

7.5ns @ CL = 3 (PC133)

–

7.5ns @ CL = 2 (PC133)

•

Self refresh

–

Standard

–

Low power

•

Operating temperature range

–

Commercial (0˚C to +70˚C)

–

Industrial (–40˚C to +85˚C)

–

Automotive (–40˚C to +105˚C)

•

Revision

Notes:

Marking

64M4

32M8

16M16

-6A

-75

-7E

None

Table 2: Key Timing Parameters

CL = CAS (READ) latency

Speed

Grade

-6A

-7E

-75

-7E

-75

Clock

Frequency

167 MHz

143 MHz

133 MHz

100 MHz

Setup

CL = 2 CL = 3 Time

–

5.4ns

6ns

5.4ns

–

1.5ns

Access Time

Hold

Time

0.8ns

1. See Micron technical note TN-48-05 on

Micron's Web site.

2. Off-center parting line.

3. Contact Micron for availability.

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. N 1/10 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 SDRAM

General Description ......................................................................................................................................... 8

Automotive Temperature ............................................................................................................................. 8

Functional Block Diagrams ............................................................................................................................... 9

Pin and Ball Assignments and Descriptions ..................................................................................................... 12

Package Dimensions ...................................................................................................................................... 16

Temperature and Thermal Impedance ............................................................................................................ 19

Electrical Specifications .................................................................................................................................. 22

Electrical Specifications – I

Parameters ........................................................................................................ 24

Electrical Specifications – AC Operating Conditions ......................................................................................... 26

Functional Description ................................................................................................................................... 31

Commands .................................................................................................................................................... 32

COMMAND INHIBIT .................................................................................................................................. 32

NO OPERATION (NOP) .............................................................................................................................. 33

LOAD MODE REGISTER (LMR) ................................................................................................................... 33

ACTIVE ...................................................................................................................................................... 33

READ ......................................................................................................................................................... 34

WRITE ....................................................................................................................................................... 35

PRECHARGE .............................................................................................................................................. 36

BURST TERMINATE ................................................................................................................................... 36

AUTO REFRESH ......................................................................................................................................... 37

SELF REFRESH ........................................................................................................................................... 37

Truth Tables ................................................................................................................................................... 38

Initialization .................................................................................................................................................. 43

Mode Register ................................................................................................................................................ 46

Burst Length .............................................................................................................................................. 48

Burst Type ................................................................................................................................................. 48

CAS Latency ............................................................................................................................................... 50

Operating Mode ......................................................................................................................................... 50

Write Burst Mode ....................................................................................................................................... 50

Bank/Row Activation ...................................................................................................................................... 51

READ Operation ............................................................................................................................................. 52

WRITE Operation ........................................................................................................................................... 61

Burst Read/Single Write .............................................................................................................................. 68

PRECHARGE Operation .................................................................................................................................. 69

Auto Precharge ........................................................................................................................................... 69

AUTO REFRESH Operation ............................................................................................................................. 81

SELF REFRESH Operation .............................................................................................................................. 83

Power-Down .................................................................................................................................................. 85

Clock Suspend ............................................................................................................................................... 86

Revision History ............................................................................................................................................. 89

Rev. N – 1/10 .............................................................................................................................................. 89

Rev. M – 11/08 ............................................................................................................................................ 89

Rev. L – 8/07 ............................................................................................................................................... 89

Rev. K – 2/07 .............................................................................................................................................. 90

Rev. K – 6/06 .............................................................................................................................................. 90

Rev. J – 3/05 ............................................................................................................................................... 90

Rev. H – 2/05 .............................................................................................................................................. 90

Rev. H – 10/04 ............................................................................................................................................ 90

Rev. G – 8/03 .............................................................................................................................................. 90

Rev. F – 1/03 ............................................................................................................................................... 90

Contents

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. N 1/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 SDRAM

Table 1: Address Table .................................................................................................................................... 1

Table 2: Key Timing Parameters ...................................................................................................................... 1

Table 3: 256Mb SDR Part Numbering ............................................................................................................... 2

Table 4: Pin and Ball Descriptions .................................................................................................................. 15

Table 5: Temperature Limits .......................................................................................................................... 19

Table 6: Thermal Impedance Simulated Values .............................................................................................. 20

Table 7: Absolute Maximum Ratings .............................................................................................................. 22

Table 8: DC Electrical Characteristics and Operating Conditions ..................................................................... 22

Table 9: Capacitance ..................................................................................................................................... 23

Table 10: I

Specifications and Conditions (-6A) ........................................................................................... 24

Table 11: I

Specifications and Conditions (-7E, -75) .................................................................................... 24

Table 12: Electrical Characteristics and Recommended AC Operating Conditions (-6A) ................................... 26

Table 13: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75) ............................. 27

Table 14: AC Functional Characteristics (-6A) ................................................................................................. 28

Table 15: AC Functional Characteristics (-7E, -75) .......................................................................................... 29

Table 16: Truth Table – Commands and DQM Operation ................................................................................ 32

Table 17: Truth Table – Current State Bank

Command to Bank

................................................................. 38

Table 18: Truth Table – Current State Bank n, Command to Bank

................................................................ 40

Table 19: Truth Table – CKE .......................................................................................................................... 42

Table 20: Burst Definition Table .................................................................................................................... 49

List of Tables

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. N 1/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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