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ST72T272K2M6/XXX

Description
IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SOP,34PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size4MB,79 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

ST72T272K2M6/XXX Overview

IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SOP,34PIN,PLASTIC

ST72T272K2M6/XXX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Reach Compliance Codenot_compliant
bit size8
CPU seriesST72
JESD-30 codeR-PDSO-G34
JESD-609 codee0
Number of terminals34
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSOP34,.4,40
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
power supply5 V
Certification statusNot Qualified
RAM (bytes)384
rom(word)8192
ROM programmabilityUVPROM
speed8 MHz
Maximum slew rate18 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1 mm
Terminal locationDUAL

ST72T272K2M6/XXX Related Products

ST72T272K2M6/XXX ST72T272K4M6/XXX ST72T272K2B6/XXX ST72T272K4B6/XXX
Description IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SOP,34PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SOP,34PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,32PIN,PLASTIC IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,32PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
bit size 8 8 8 8
CPU series ST72 ST72 ST72 ST72
JESD-30 code R-PDSO-G34 R-PDSO-G34 R-PDIP-T32 R-PDIP-T32
JESD-609 code e0 e0 e0 e0
Number of terminals 34 34 32 32
On-chip program ROM width 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP SSOP SDIP SDIP
Encapsulate equivalent code SOP34,.4,40 SOP34,.4,40 SDIP32,.4 SDIP32,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH IN-LINE, SHRINK PITCH IN-LINE, SHRINK PITCH
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 384 512 384 512
rom(word) 8192 16384 8192 16384
ROM programmability UVPROM UVPROM UVPROM UVPROM
speed 8 MHz 8 MHz 8 MHz 8 MHz
Maximum slew rate 18 mA 18 mA 18 mA 18 mA
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES YES NO NO
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1 mm 1 mm 1.78 mm 1.78 mm
Terminal location DUAL DUAL DUAL DUAL
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