IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,32PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Reach Compliance Code | not_compliant |
| bit size | 8 |
| CPU series | ST72 |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| Number of terminals | 32 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Encapsulate equivalent code | SDIP32,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 512 |
| rom(word) | 16384 |
| ROM programmability | UVPROM |
| speed | 8 MHz |
| Maximum slew rate | 18 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.78 mm |
| Terminal location | DUAL |
| ST72T272K4B6/XXX | ST72T272K4M6/XXX | ST72T272K2M6/XXX | ST72T272K2B6/XXX | |
|---|---|---|---|---|
| Description | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,32PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SOP,34PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SOP,34PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,SDIP,32PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| bit size | 8 | 8 | 8 | 8 |
| CPU series | ST72 | ST72 | ST72 | ST72 |
| JESD-30 code | R-PDIP-T32 | R-PDSO-G34 | R-PDSO-G34 | R-PDIP-T32 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 32 | 34 | 34 | 32 |
| On-chip program ROM width | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SDIP | SSOP | SSOP | SDIP |
| Encapsulate equivalent code | SDIP32,.4 | SOP34,.4,40 | SOP34,.4,40 | SDIP32,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 512 | 512 | 384 | 384 |
| rom(word) | 16384 | 16384 | 8192 | 8192 |
| ROM programmability | UVPROM | UVPROM | UVPROM | UVPROM |
| speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| Maximum slew rate | 18 mA | 18 mA | 18 mA | 18 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.78 mm | 1 mm | 1 mm | 1.78 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
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