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DIM800XSM33-F000_11

Description
Single Switch IGBT Module
File Size310KB,8 Pages
ManufacturerDynex
Websitehttp://www.dynexsemi.com/
Download Datasheet View All

DIM800XSM33-F000_11 Overview

Single Switch IGBT Module

DIM800XSM33-F000
Single Switch IGBT Module
Replaces DS5906-1.2
DS5906-2 August 2011 (LN28652)
FEATURES
10µs Short Circuit Withstand
High Thermal Cycling Capability
Soft Punch Through Silicon
Isolated AlSiC Base with AlN Substrates
Lead Free Construction
10.2kV Isolation Package
KEY PARAMETERS
V
CES
V
CE(sat)
* (typ)
I
C
(max)
I
C(PK)
(max)
3300V
2.8V
800A
1600A
* Measured at the auxiliary terminals
7(C)
5(C)
APPLICATIONS
3(C)
High Reliability Inverters
Motor Controllers
Traction Drives
Choppers
1(E)
6(E)
4(E)
2(G)
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 1200V to
6500V and currents up to 2400A.
The DIM800XSM33-F000 is a single switch 3300V,
soft punch through n-channel enhancement mode,
insulated gate bipolar transistor (IGBT) module. The
IGBT has a wide reverse bias safe operating area
(RBSOA) plus 10μs short circuit withstand. This
device is optimised for traction drives and other
applications requiring high thermal cycling capability.
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety
.
Fig. 1 Circuit configuration
ORDERING INFORMATION
Order As:
DIM800XSM33-F000
Note: When ordering, please use the complete part
number
Outline type code: X
(See Fig. 11 for further information)
Fig. 2 Package
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
1
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www.dynexsemi.com
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