Microprocessor, 8-Bit, 10MHz, CMOS, PDIP64, PLASTIC, DIP-64
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IXYS |
| Parts packaging code | DIP |
| package instruction | PLASTIC, DIP-64 |
| Contacts | 64 |
| Reach Compliance Code | unknown |
| Other features | DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY |
| bit size | 8 |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| length | 57.785 mm |
| Number of terminals | 64 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Encapsulate equivalent code | SDIP64,.75 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.01 mm |
| speed | 10 MHz |
| Maximum slew rate | 60 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.78 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
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