Z8031DCB datasheet, PDF - EEWORLD Datasheet

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Z8031DCB: DescriptionMicro Peripheral IC, MOS, CDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size943KB，29 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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Z8031DCB Overview

Micro Peripheral IC, MOS, CDIP40

Z8031DCB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	DIP, DIP40,.6
Reach Compliance Code	compliant
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Z8031DCB Related Products

	Z8031DCB	Z8531APC	Z8531ADC	Z8031PC	Z8031DC	Z8531PC	Z8531DC
Description	Micro Peripheral IC, MOS, CDIP40	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, PDIP40, PLASTIC, DIP-40	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, PDIP40, PLASTIC, DIP-40	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, PDIP40, PLASTIC, DIP-40	Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compli
JESD-30 code	R-XDIP-T40	R-PDIP-T40	R-GDIP-T40	R-PDIP-T40	R-GDIP-T40	R-PDIP-T40	R-GDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	40	40	40	40	40	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	AMD	-	-	AMD	AMD	AMD	AMD
Parts packaging code	-	DIP	DIP	DIP	DIP	DIP	DIP
Contacts	-	40	40	40	40	40	40
boundary scan	-	NO	NO	NO	NO	NO	NO
Bus compatibility	-	8080; Z80; 6800; 68000; MULTIBUS	8080; Z80; 6800; 68000; MULTIBUS	Z8000; 8086	Z8000; 8086	8080; Z80; 6800; 68000; MULTIBUS	8080; Z80; 6800; 68000; MULTIBUS
maximum clock frequency	-	6.06 MHz	6.06 MHz	4 MHz	4 MHz	4 MHz	4 MHz
letter of agreement	-	ASYNC, BIT	ASYNC, BIT	ASYNC, BIT	ASYNC, BIT	ASYNC, BIT	ASYNC, BIT
Data encoding/decoding methods	-	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
Maximum data transfer rate	-	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps	0.125 MBps
External data bus width	-	8	8	8	8	8	8
length	-	52.2605 mm	52.324 mm	52.2605 mm	52.324 mm	52.2605 mm	52.324 mm
low power mode	-	NO	NO	NO	NO	NO	NO
Number of serial I/Os	-	2	2	2	2	2	2
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-	5 V	5 V	-	-	5 V	5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	5.461 mm	5.715 mm	5.461 mm	5.715 mm	5.461 mm	5.715 mm
Maximum slew rate	-	250 mA	250 mA	250 mA	250 mA	250 mA	250 mA
Maximum supply voltage	-	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	-	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	-	5 V	5 V	5 V	5 V	5 V	5 V
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	-	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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