SPST, 4 Func, 1 Channel, CMOS, CDIP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Harris |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NC |
| Number of channels | 1 |
| Number of functions | 4 |
| Number of terminals | 16 |
| Nominal off-state isolation | 72 dB |
| On-state resistance matching specifications | 0.9 Ω |
| Maximum on-state resistance (Ron) | 50 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum disconnect time | 50 ns |
| Maximum connection time | 50 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| HI1-0201HS/883 | HI4-0201HS/883 | HI1-0201HS-2 | HI1-0201HS-5 | HI9P0201HS-5 | HI9P0201HS-9 | |
|---|---|---|---|---|---|---|
| Description | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, CQCC20 | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, PDSO16 | SPST, 4 Func, 1 Channel, CMOS, PDSO16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Harris | Harris | Harris | Harris | Harris | Harris |
| Reach Compliance Code | unknown | unknown | unknow | unknow | unknow | unknow |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 code | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| normal position | NC | NC | NC | NC | NC | NC |
| Number of channels | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 16 | 20 | 16 | 16 | 16 | 16 |
| Nominal off-state isolation | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB |
| On-state resistance matching specifications | 0.9 Ω | 0.9 Ω | 0.9 Ω | 0.9 Ω | 0.9 Ω | 0.9 Ω |
| Maximum on-state resistance (Ron) | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 75 °C | 75 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | - | -40 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCN | DIP | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | SOP16,.4 | SOP16,.4 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | YES | NO | NO | YES | YES |
| Maximum disconnect time | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| Maximum connection time | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
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