Microcontroller, 8-Bit, UVPROM, Z8 CPU, 8MHz, CMOS, PDIP64,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IXYS |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| Address bus width | 16 |
| bit size | 8 |
| CPU series | Z8 |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | R-PDIP-T64 |
| length | 57.785 mm |
| Number of I/O lines | 51 |
| Number of terminals | 64 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Encapsulate equivalent code | DIP64(UNSPEC) |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 1024 |
| rom(word) | 32768 |
| ROM programmability | UVPROM |
| speed | 8 MHz |
| Maximum slew rate | 15 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.78 mm |
| Terminal location | DUAL |
| width | 19.05 mm |





| Z86E7408PSC | Z86L7408VSC | Z86E7408VSC | |
|---|---|---|---|
| Description | Microcontroller, 8-Bit, UVPROM, Z8 CPU, 8MHz, CMOS, PDIP64, | Microcontroller, 8-Bit, MROM, Z8 CPU, 8MHz, CMOS, PQCC68, | Microcontroller, 8-Bit, UVPROM, Z8 CPU, 8MHz, CMOS, PQCC68, |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | IXYS | IXYS | IXYS |
| Reach Compliance Code | unknown | unknown | unknow |
| Has ADC | NO | NO | NO |
| Address bus width | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 |
| CPU series | Z8 | Z8 | Z8 |
| maximum clock frequency | 8 MHz | 8 MHz | 8 MHz |
| DAC channel | NO | NO | NO |
| DMA channel | NO | NO | NO |
| External data bus width | 8 | 8 | 8 |
| JESD-30 code | R-PDIP-T64 | S-PQCC-J68 | S-PQCC-J68 |
| length | 57.785 mm | 24.23 mm | 24.23 mm |
| Number of I/O lines | 51 | 51 | 51 |
| Number of terminals | 64 | 68 | 68 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| PWM channel | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SDIP | QCCJ | QCCJ |
| Encapsulate equivalent code | DIP64(UNSPEC) | LDCC68,1.0SQ | LDCC68,1.0SQ |
| Package shape | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE, SHRINK PITCH | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 2.2/3.6 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 1024 | 1024 | 1024 |
| rom(word) | 32768 | 32768 | 32768 |
| ROM programmability | UVPROM | MROM | UVPROM |
| speed | 8 MHz | 8 MHz | 8 MHz |
| Maximum slew rate | 15 mA | 15 mA | 15 mA |
| Maximum supply voltage | 5.5 V | 3.9 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 2 V | 4.5 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 1.78 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD |
| width | 19.05 mm | 24.23 mm | 24.23 mm |
| Nominal supply voltage | 5 V | - | 5 V |