MAX5309EUE
Rev. A
RELIABILITY REPORT
FOR
MAX5309EUE
PLASTIC ENCAPSULATED DEVICES
March 30, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX5309 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX5309 is a10-bit, eight channel, low-power, voltage-output, digital-to-analog converters (DAC) in a space-
saving 16-pin TSSOP package. The wide +2.7V to +5.5V supply voltage range and less than 215µA (max) supply
current per DAC is excellent for low-power and low-voltage applications. The low 2nV-s glitch energy of the MAX5309
makes it ideal for digital control of fast-response, closed-loop systems.
The MAX5309 has a hardware reset input (CLR-bar) which clears all registers and DACs to zero. The MAX5309 has
a software shutdown feature that reduces the supply current to 1µA. The MAX5308 features a load DAC (LDAC-bar)
function that updates the output of all eight DACs simultaneously.
The 3-wire SPI™, QSPI™, MICROWIRE™ and DSP-compatible serial interface allows the input and DAC registers
to be updated independently or simultaneously with a single software command. This device uses a double-buffered
design to minimize the digital-noise feedthrough from the digital inputs to the outputs. The MAX5309 operating
temperature range is from -40°C to +85°C
B. Absolute Maximum Ratings
Item
VDD to GND
All Other Pins to GND
Maximum Current Into Any Pin
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
16-Pin TSSOP
Derates above +70°C
16-Pin TSSOP
Rating
-0.3V to +6V
-0.3V to (VDD + 0.3V)
±50mA
-40°C to +85°C
+150°C
-65°C to +150°C
+300°C
775mW
9.4mW/°C
II. Manufacturing Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
Low-Power, Low-Glitch, Octal 10-Bit Voltage-Output DACs with Serial Interface
S6 (Standard 0.6 micron silicon gate CMOS)
19,000
California, USA
Malaysia or Thailand
July, 2001
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-020-A:
16-Pin TSSOP
Copper
Solder Plate
Silver-Filled Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
#05-3901-0002
Class UL94-V0
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
102 x 141 mils
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
0.6 microns (as drawn)
0.6 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Manager, Rel Operations)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in
Table 1.
Using these results, the Failure
Rate (λ) is calculated as follows:
λ
=
1
=
MTTF
1.83
192 x 4389 x 79 x 2
(Chi square value for MTTF upper limit)
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 13.75 x 10
-9
λ
= 13.75 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5814) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The DB06 die type has been found to have all pins able to withstand a transient pulse of
±1500V
per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±250mA.
Table 1
Reliability Evaluation Test Results
MAX5309EUE
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
PACKAGE
Static Life Test
(Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing
(Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
79
0
DC Parameters
& functionality
TSSOP
77
0
85/85
DC Parameters
& functionality
77
0
Mechanical Stress
(Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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