MAX5306 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > semiconductor> logic> MAX5306

MAX5306: DescriptionSERIAL INPUT LOADING, 5 us SETTLING TIME, 10-BIT DAC, PDSO16; Categorysemiconductor logic; File Size95KB，8 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

Download Datasheet Parametric Compare View All

MAX5306 Overview

SERIAL INPUT LOADING, 5 us SETTLING TIME, 10-BIT DAC, PDSO16

MAX5306 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Rated supply voltage	5 V
Maximum linear error	0.1953 %
Processing package description	6.40 X 5 MM, MO-153AB, TSSOP-16
state	ACTIVE
Craftsmanship	BICMOS
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.6500 mm
terminal coating	TIN LEAD
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	INDUSTRIAL
Input format	SERIAL
Type of converter	10-BIT DAC
Input bit encoding	BINARY
Rated settling time	5 us
Maximum analog output voltage	4.98 V
Minimum analog output voltage	0.0200 V

Preview

Download Datasheet

View All

MAX5309EUE

Rev. A

RELIABILITY REPORT

FOR

MAX5309EUE

PLASTIC ENCAPSULATED DEVICES

March 30, 2004

MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086

Written by

Reviewed by

Jim Pedicord

Quality Assurance

Reliability Lab Manager

Bryan J. Preeshl

Quality Assurance

Executive Director

Conclusion

The MAX5309 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality

and reliability standards.

Table of Contents

I. ........Device Description

II. ........Manufacturing Information

III. .......Packaging Information

V. ........Quality Assurance Information

VI. .......Reliability Evaluation

IV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX5309 is a10-bit, eight channel, low-power, voltage-output, digital-to-analog converters (DAC) in a space-

saving 16-pin TSSOP package. The wide +2.7V to +5.5V supply voltage range and less than 215µA (max) supply

current per DAC is excellent for low-power and low-voltage applications. The low 2nV-s glitch energy of the MAX5309

makes it ideal for digital control of fast-response, closed-loop systems.

The MAX5309 has a hardware reset input (CLR-bar) which clears all registers and DACs to zero. The MAX5309 has

a software shutdown feature that reduces the supply current to 1µA. The MAX5308 features a load DAC (LDAC-bar)

function that updates the output of all eight DACs simultaneously.

The 3-wire SPI™, QSPI™, MICROWIRE™ and DSP-compatible serial interface allows the input and DAC registers

to be updated independently or simultaneously with a single software command. This device uses a double-buffered

design to minimize the digital-noise feedthrough from the digital inputs to the outputs. The MAX5309 operating

temperature range is from -40°C to +85°C

B. Absolute Maximum Ratings

Item

VDD to GND

All Other Pins to GND

Maximum Current Into Any Pin

Operating Temperature Range

Junction Temperature

Storage Temperature Range

Lead Temperature (soldering, 10s)

Continuous Power Dissipation (TA = +70°C)

16-Pin TSSOP

Derates above +70°C

16-Pin TSSOP

Rating

-0.3V to +6V

-0.3V to (VDD + 0.3V)

±50mA

-40°C to +85°C

+150°C

-65°C to +150°C

+300°C

775mW

9.4mW/°C

V. Quality Assurance Information

A. Quality Assurance Contacts:

Jim Pedicord (Manager, Rel Operations)

Bryan Preeshl (Executive Director)

Kenneth Huening (Vice President)

0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

B. Outgoing Inspection Level:

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135°C biased (static) life test are shown in

Table 1.

Using these results, the Failure

Rate (λ) is calculated as follows:

MTTF

1.83

192 x 4389 x 79 x 2

(Chi square value for MTTF upper limit)

Temperature Acceleration factor assuming an activation energy of 0.8eV

= 13.75 x 10

-9

= 13.75 F.I.T. (60% confidence level @ 25°C)

This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to

routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects

it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be

shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece

sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In

Schematic (Spec. # 06-5814) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test

monitors. This data is published in the Product Reliability Report (RR-1M).

B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample

must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard

85°C/85%RH testing is done per generic device/package family once a quarter.

C. E.S.D. and Latch-Up Testing

The DB06 die type has been found to have all pins able to withstand a transient pulse of

±1500V

per Mil-

Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device

withstands a current of

±250mA.

MAX5306 Related Products

	MAX5306	MAX5307	MAX5308	MAX5309
Description	SERIAL INPUT LOADING, 5 us SETTLING TIME, 10-BIT DAC, PDSO16	SERIAL INPUT LOADING, 5 us SETTLING TIME, 10-BIT DAC, PDSO16	SERIAL INPUT LOADING, 5 us SETTLING TIME, 10-BIT DAC, PDSO16	SERIAL INPUT LOADING, 5 us SETTLING TIME, 10-BIT DAC, PDSO16
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
Maximum operating temperature	85 Cel	85 Cel	85 Cel	85 Cel
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 Cel
Rated supply voltage	5 V	5 V	5 V	5 V
Maximum linear error	0.1953 %	0.1953 %	0.1953 %	0.1953 %
Processing package description	6.40 X 5 MM, MO-153AB, TSSOP-16	6.40 X 5 MM, MO-153AB, TSSOP-16	6.40 X 5 MM, MO-153AB, TSSOP-16	6.40 X 5 MM, MO-153AB, TSSOP-16
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Craftsmanship	BICMOS	BICMOS	BICMOS	BICMOS
packaging shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package Size	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
surface mount	Yes	Yes	Yes	Yes
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal spacing	0.6500 mm	0.6500 mm	0.6500 mm	0.6500 mm
terminal coating	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL
Packaging Materials	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Input format	SERIAL	SERIAL	SERIAL	SERIAL
Type of converter	10-BIT DAC	10-BIT DAC	10-BIT DAC	10-BIT DAC
Input bit encoding	BINARY	BINARY	BINARY	BINARY
Rated settling time	5 us	5 us	5 us	5 us
Maximum analog output voltage	4.98 V	4.98 V	4.98 V	4.98 V
Minimum analog output voltage	0.0200 V	0.0200 V	0.0200 V	0.0200 V

Recommended Resources

Address decoding circuit

Synchronous operation circuit of two AC commutator motors

Infrared receiving circuit with pre-integrated amplifier

MC3X164 series reset circuit diagram

Reversible flowing water lantern controller

Full wave control circuit of series motor

FPGA Quick Start 8-Buzzer.doc: FPGA Quick Start 8-Buzzer.doc...; zxopenljx FPGA/CPLD

Custom eye height measurement: Custom eye height measurement...; 安_然 Test/Measurement

[Record] Based on ARM, Linux development——by ywlzh: [url=home.php?mod=space&uid=623893]@ywlzh[/url] [url=https://bbs.eeworld.com.cn/thread-495520-1-1.html][size=3][Record] -- Preparation work before Linux development based on ARM[/size][/url] [url=http...; okhxyyo ARM Technology

Where is the list of national electronic competitions in 2013?: [i=s]This post was last edited by paulhyde on 2014-9-15 03:44[/i] Where is the list of the 2013 national electronic competitions?...; 799879197 Electronics Design Contest

Could you please tell me what is the function of DDB file in PROTEL99? Are sch files and PCB files placed in the DDB file?: Could you please tell me what is the function of DDB file in PROTEL99? Are sch files and PCB files placed in the DDB file?...; 深圳小花 MCU

How to learn prteus simulation software: I hope you can give me some valuable suggestions and some simple small programs so that I can make them myself. It would be best if they come with graphic explanations. Thank you......; wzqqz Embedded System

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components