MPC8548EPXAUJB datasheet, PDF - EEWORLD Datasheet

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MPC8548EPXAUJB: Description32-BIT, 1333 MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，144 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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MPC8548EPXAUJB Overview

32-BIT, 1333 MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783

MPC8548EPXAUJB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	BGA,
Contacts	783
Reach Compliance Code	unknown
Address bus width	64
bit size	32
boundary scan	YES
maximum clock frequency	133 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B783
JESD-609 code	e0
length	29 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	783
Maximum operating temperature	105 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
Certification status	COMMERCIAL
Maximum seat height	3.38 mm
speed	1333 MHz
Maximum supply voltage	1.155 V
Minimum supply voltage	1.045 V
Nominal supply voltage	1.1 V
surface mount	YES
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	29 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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MPC8548EPXAUJB Related Products

	MPC8548EPXAUJB	MPC8548ECPXAUJB	MPC8548EPXAQGB	MPC8548ECPXAQGB	MPC8548EVTAUJB	MPC8548ECVTAQGB	MPC8548EVTAQGB	MPC8548ECPXATGB	MPC8548EVTAQGA
Description	32-BIT, 1333 MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	32-BIT, 1333 MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	32-BIT, 1000MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	32-BIT, 1000MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	32-BIT, 1333 MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783	32-BIT, 1000MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783	32-BIT, 1000MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783	32-BIT, 1200MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	32-BIT, 1000MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	BGA,	29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783	29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783	29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783	29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783
Contacts	783	783	783	783	783	783	783	783	783
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
Address bus width	64	64	64	64	64	64	64	64	64
bit size	32	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz
External data bus width	64	64	64	64	64	64	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783	S-PBGA-B783
JESD-609 code	e0	e0	e2	e0	e2	e0	e2	e0	e2
length	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of terminals	783	783	783	783	783	783	783	783	783
Maximum operating temperature	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260	260
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	3.38 mm	3.38 mm	3.38 mm	3.38 mm	3.38 mm	3.38 mm	3.38 mm	3.38 mm	3.38 mm
speed	1333 MHz	1333 MHz	1000 MHz	1000 MHz	1333 MHz	1000 MHz	1000 MHz	1200 MHz	1000 MHz
Maximum supply voltage	1.155 V	1.155 V	1.155 V	1.155 V	1.155 V	1.155 V	1.155 V	1.155 V	1.155 V
Minimum supply voltage	1.045 V	1.045 V	1.045 V	1.045 V	1.045 V	1.045 V	1.045 V	1.045 V	1.045 V
Nominal supply voltage	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	OTHER	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER
Terminal surface	TIN LEAD	TIN LEAD	TIN COPPER/TIN SILVER	TIN LEAD	TIN COPPER/TIN SILVER	TIN LEAD	TIN SILVER	TIN LEAD	TIN SILVER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40	40
width	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm	29 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Maker	Rochester Electronics	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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