4020 POWER INDUCTORS
High Reliability Power Inductors
MS433PYA
I
High temperature materials allow operation in ambient
temperatures up to 155°C
I
Tin-lead (Sn-Pb) termination for the best possible board
adhesion
I
Exceptionally low DCR – 5.81 mOhm
I
Soft saturation makes them ideal for VRM/VRD applications.
Terminations
Tin-lead (63/37) over copper.
Core material
Composite
Weight
0.17 – 0.18 g
Ambient temperature
–55°C to +105°C with
Irms
current, +105°C to
+155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
1000/7″reel; 3500/13″ reel
Plastic tape: 12 mm wide, 0.23 mm thick, 8 mm pocket spacing,
2.3 mm pocket depth
Part number
MS433PYA221MSZ
MS433PYA401MSZ
MS433PYA601MSZ
MS433PYA102MSZ
MS433PYA152MSZ
MS433PYA222MSZ
1
Inductance
2
±20% (µH)
0.22
0.40
0.60
1.0
1.5
2.2
DCR (mOhms)
3
typ
max
5.81
6.40
7.55
8.30
9.50
10.45
13.25
14.60
21.45
23.60
35.20
38.70
SRF (MHz)
4
min
typ
153
191
116
145
85
106
63
79
51
64
42
52
Isat
5
(A)
18.7
12.5
10.4
8.7
7.1
5.6
Irms
(A)
6
20°C rise 40°C rise
12.0
16.8
10.0
14.0
7.9
11.7
6.7
9.6
5.2
7.5
4.0
5.5
1. When ordering, please specify
testing
code:
MS433PYA222MSZ
Testing:
Z
= COTS
H
= Screening per Coilcraft CP-SA-10001
N
= Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Irms
Testing
Irms
testing was performed on 0.75 inch
wide × 0.25 inch thick copper traces in
still air.
Temperature rise is highly dependent on
many factors including pcb land pattern,
trace size, and proximity to other compo-
nents. Therefore temperature rise should
be verified in application conditions.
®
Specifications subject to change without notice.
Please check our website for latest information.
Document MS806-1 Revised 01/18/12
1102 Silver Lake Road
Cary IL 60013
© Coilcraft, Inc. 2012
Phone 800-981-0363
Fax 847-639-1508
E-mail cps@coilcraft.com
Web www.coilcraft-cps.com
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