MK20N512VLK100 datasheet, PDF - EEWORLD Datasheet

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MK20N512VLK100: Description32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP80, 12 X 12 MM, LQFP-80; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，65 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MK20N512VLK100 Overview

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP80, 12 X 12 MM, LQFP-80

MK20N512VLK100 Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	QFP
package instruction	LFQFP, QFP80,.55SQ,20
Contacts	80
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	50 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G80
length	12 mm
Number of I/O lines	54
Number of terminals	80
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP80,.55SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
power supply	1.8/3.3 V
Certification status	Not Qualified
RAM (bytes)	131072
rom(word)	524288
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	100 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.71 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	12 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Freescale Semiconductor

Data Sheet: Product Preview

Document Number: K20P81M100SF2

Rev. 4, 3/2011

K20 Sub-Family Data Sheet

K20P81M100SF2

Supports the following:

MK20X256VLK100, MK20N512VLK100,

MK20X256VMB100,

MK20N512VMB100

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (up to x64) integrated

into each ADC

– 12-bit DAC

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

• Communication interfaces

– USB full-/low-speed On-the-Go controller with on-

chip transceiver

– Two Controller Area Network (CAN) modules

– Two SPI modules

– Two I2C modules

– Four UART modules

– Secure Digital host controller (SDHC)

– I2S module

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

This document contains information on a product under development. Freescale

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

1 Ordering parts...........................................................................3

1.1 Determining valid orderable parts......................................3

2 Part identification......................................................................3

2.1 Description.........................................................................3

2.2 Format...............................................................................3

2.3 Fields.................................................................................3

2.4 Example............................................................................4

3 Terminology and guidelines......................................................4

3.1 Definition: Operating requirement......................................4

3.2 Definition: Operating behavior...........................................5

3.3 Definition: Attribute............................................................5

3.4 Definition: Rating...............................................................6

3.5 Result of exceeding a rating..............................................6

3.6 Relationship between ratings and operating

requirements......................................................................6

3.7 Guidelines for ratings and operating requirements............7

3.8 Definition: Typical value.....................................................7

3.9 Typical value conditions....................................................8

4 Ratings......................................................................................8

4.1 Thermal handling ratings...................................................9

4.2 Moisture handling ratings..................................................9

4.3 ESD handling ratings.........................................................9

4.4 Voltage and current operating ratings...............................9

5 General.....................................................................................10

5.1 Nonswitching electrical specifications...............................10

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

Voltage and current operating requirements......10

LVD and POR operating requirements...............11

Voltage and current operating behaviors............12

Power mode transition operating behaviors.......12

Power consumption operating behaviors............13

EMC radiated emissions operating behaviors....16

Designing with radiated emissions in mind.........17

Capacitance attributes........................................17

6.8.7

6.8.8

6.8.9

6.8.10

6.8.6

6.1 Core modules....................................................................19

6.1.1

6.1.2

Debug trace timing specifications.......................20

JTAG electricals..................................................20

6.2 System modules................................................................23

6.3 Clock modules...................................................................23

6.3.1

6.3.2

6.3.3

MCG specifications.............................................23

Oscillator electrical specifications.......................26

32kHz Oscillator Electrical Characteristics.........28

6.4 Memories and memory interfaces.....................................28

6.4.1

6.4.2

6.4.3

Flash (FTFL) electrical specifications.................29

EzPort Switching Specifications.........................30

Flexbus Switching Specifications........................31

6.5 Security and integrity modules..........................................33

6.6 Analog...............................................................................33

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................33

CMP and 6-bit DAC electrical specifications......41

12-bit DAC electrical characteristics...................44

Voltage reference electrical specifications..........47

6.7 Timers................................................................................48

6.8 Communication interfaces.................................................48

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

USB electrical specifications...............................49

USB DCD electrical specifications......................49

USB VREG electrical specifications...................49

CAN switching specifications..............................50

DSPI switching specifications (low-speed

mode)..................................................................50

DSPI switching specifications (high-speed

mode)..................................................................51

I2C switching specifications................................53

UART switching specifications............................53

SDHC specifications...........................................53

I2S switching specifications................................54

6.9 Human-machine interfaces (HMI)......................................56

6.9.1

TSI electrical specifications................................56

5.2 Switching specifications.....................................................17

5.2.1

5.2.2

Device clock specifications.................................17

General switching specifications.........................18

7 Dimensions...............................................................................57

7.1 Obtaining package dimensions.........................................57

8 Pinout........................................................................................58

8.1 K20 Signal Multiplexing and Pin Assignments..................58

8.2 K20 Pinouts.......................................................................62

9 Revision History........................................................................63

5.3 Thermal specifications.......................................................18

5.3.1

5.3.2

Thermal operating requirements.........................18

Thermal attributes...............................................19

6 Peripheral operating requirements and behaviors....................19

K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Preliminary

Freescale Semiconductor, Inc.

MK20N512VLK100 Related Products

	MK20N512VLK100	MK20X256VMB100	MK20X256VMB100R	MK20N512VLK100R	MK20N512VMB100R
Description	32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP80, 12 X 12 MM, LQFP-80	32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA81, 8 X 8 MM, MAPBGA-81	32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA81, 8 X 8 MM, MAPBGA-81	32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP80, 12 X 12 MM, LQFP-80	32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA81, 8 X 8 MM, MAPBGA-81
Maker	NXP	NXP	NXP	NXP	NXP
Parts packaging code	QFP	BGA	BGA	QFP	BGA
package instruction	LFQFP, QFP80,.55SQ,20	LFBGA, BGA81,9X9,32	LFBGA, BGA81,9X9,32	LFQFP, QFP80,.55SQ,20	LFBGA, BGA81,9X9,40
Contacts	80	81	81	80	81
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Has ADC	YES	YES	YES	YES	YES
bit size	32	32	32	32	32
maximum clock frequency	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC channel	YES	YES	YES	YES	YES
DMA channel	YES	YES	YES	YES	YES
JESD-30 code	S-PQFP-G80	S-PBGA-B81	S-PBGA-B81	S-PQFP-G80	S-PBGA-B81
length	12 mm	8 mm	8 mm	12 mm	8 mm
Number of I/O lines	54	56	56	54	56
Number of terminals	80	81	81	80	81
Maximum operating temperature	105 °C	105 °C	105 °C	105 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFBGA	LFBGA	LFQFP	LFBGA
Encapsulate equivalent code	QFP80,.55SQ,20	BGA81,9X9,32	BGA81,9X9,32	QFP80,.55SQ,20	BGA81,9X9,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	131072	131072	131072	131072	131072
rom(word)	524288	262144	262144	524288	524288
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.6 mm	1.3 mm	1.3 mm	1.6 mm	1.3 mm
speed	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	BALL	GULL WING	BALL
Terminal pitch	0.5 mm	0.65 mm	0.65 mm	0.5 mm	0.65 mm
Terminal location	QUAD	BOTTOM	BOTTOM	QUAD	BOTTOM
width	12 mm	8 mm	8 mm	12 mm	8 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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