Polypropylene
Film Capacitors
F
EATURES
•
•
•
•
Low dissipation factor and high insulation resistance
High stability of capacitance and DF versus temperature and
frequency
Low ESR
Non-inductive construction
DPPN
Series
(Radial Dipped)
MERITEK
S
PECIFICATIONS
1. Operating temperature:
2.
3.
4.
5.
6.
Capacitance range:
Capacitance tolerance:
Rated voltage:
Dissipation factor:
Insulation resistance:
-40
o
C to +85
o
C
0.001μF to 0.47μF
±5%(J), ±10%(K), ±20%(M)
50VDC, 100VDC, 250VDC, 400VDC,
630VDC
0.1% max. at 1KHz 25
o
C
>30000MΩ (C
≤
0.1μF)
>3000MΩ
μF
(C > 0.1μF )
are constructed with polypropylene film
dielectric, aluminum foil electrodes, tinned copper
leads, and a non-inductive epoxy resin coating.
They are suitable for blocking, bypass, coupling,
circuit isolation, and temperature compensation.
DPPN are ideal for use in telecommunication
equipment, data processing equipment, industrial
instruments, automatic control systems, etc.
DPPN
P
ART
N
UMBERING
S
YSTEM
Meritek Series
Capacitance
CODE
( pF )
( nF )
(
μF
)
102
1,000
1
0.001
103
10,000
10
0.01
104
100,000
100
0.1
105
1000
1
DPPN
103
K
2A
Tolerance
CODE
Tolerance (%)
J
±5
K
± 10
M
± 20
Rated Voltage
CODE
1H
50V
2A
100V
2E
250V
2G
400V
2J
630V
Tape & Reel/Tape & Ammo available for lead space < 10 mm
Please contact factory for part number.
Dimensions in millimeters (mm)
RV
DIM
50VDC/100VDC
W
H
10.0
10.0
10.0
10.0
10.0
10.5
10.5
11.0
11.0
12.0
13.5
13.5
13.0
14.0
16.0
18.0
18.0
21.0
24.0
250VDC
dØ
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
0.8
0.8
400VDC
P± 1
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
10.0
10.0
15.0
15.0
15.0
15.0
15.0
21.0
27.0
27.0
27.0
630VDC
P± 1
7.0
7.0
7.0
7.0
10.0
10.0
10.0
10.0
15.0
15.0
15.0
21.0
21.0
21.0
21.0
27.0
T
6.0
6.0
6.0
6.0
6.5
7.0
7.0
7.0
7.0
7.5
8.0
9.0
8.0
9.0
10.0
11.0
11.0
12.0
14.0
P± 1
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
10.0
10.0
10.0
10.0
15.0
15.0
15.0
15.0
21.0
27.0
27.0
W
11.0
11.0
11.0
11.0
11.0
11.0
11.0
11.0
14.0
14.0
20.0
20.0
20.0
20.0
20.0
26.0
32.0
32.0
32.0
H
10.0
10.0
10.0
10.0
10.0
10.5
10.5
11.0
11.0
12.0
13.0
14.0
15.0
16.0
18.0
18.0
20.0
23.0
27.0
T
6.0
6.0
6.0
6.0
6.5
7.0
7.0
7.0
7.0
7.5
8.0
9.0
10.0
10.0
10.0
11.0
13.0
13.0
16.0
dØ
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
0.8
0.8
0.8
W
11.0
11.0
11.0
11.0
14.0
14.0
14.0
14.0
20.0
20.0
20.0
26.0
26.0
26.0
26.0
32.0
H
10.0
10.0
10.0
10.0
11.0
11.0
11.0
12.0
12.0
13.0
15.0
16.0
17.0
18.0
20.0
23.0
T
6.0
6.0
6.0
6.0
7.0
7.0
7.0
7.5
7.5
9.0
9.5
8.0
9.0
10.0
11.0
12.
dØ
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
0.8
0.8
0.8
W
11.0
11.0
14.0
14.0
14.0
20.0
20.0
20.0
20.0
20.0
26.0
26.0
26.0
26.0
32.0
H
10.0
10.0
10.0
11.0
12.0
12.0
13.0
14.0
15.0
17.0
17.0
19.0
20.0
22.0
22.0
T
6.0
7.0
6.0
7.0
7.0
7.5
8.0
8.0
9.0
10.0
10.0
12.0
13.0
14.0
13.0
P± 1
7.0
7.0
10.0
10.0
10.0
15.0
15.0
15.0
15.0
15.0
21.0
21.0
21.0
21.0
27.0
dØ
0.6
0.6
CAP(μF)
0.0010
0.0015
0.0022
0.0033
0.0047
0.0056
0.0068
0.010
0.015
0.022
0.033
0.047
0.056
0.068
0.10
0.15
0.22
0.33
0.47
11.0
11.0
11.0
11.0
11.0
11.0
11.0
11.0
14.0
14.0
14.0
14.0
20.0
20.0
20.0
20.0
26.0
32.0
32.0
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
0.8
0.8
0.8
Specifications are
subject to change without notice.
rev.6a
Embedded System
京公网安备 11010802033920号
EEWORLD
