|
LM10CH/NOPB |
LM10BH/NOPB |
LM10CWMX/NOPB |
LM10CWM/NOPB |
LM10CLN/NOPB |
LM10CN/NOPB |
| Description |
IC OP-AMP, 5000 uV OFFSET-MAX, MBCY8, METAL CAN-8, Operational Amplifier |
IC OP-AMP, 3000 uV OFFSET-MAX, MBCY8, METAL CAN-8, Operational Amplifier |
IC OP-AMP, 5000 uV OFFSET-MAX, PDSO14, PLASTIC, SOP-14, Operational Amplifier |
IC OP-AMP, 5000 uV OFFSET-MAX, PDSO14, PLASTIC, SOP-14, Operational Amplifier |
IC OP-AMP, 5000 uV OFFSET-MAX, PDIP8, DIP-8, Operational Amplifier |
IC OP-AMP, 5000 uV OFFSET-MAX, PDIP8, DIP-8, Operational Amplifier |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Parts packaging code |
BCY |
BCY |
SOIC |
SOIC |
DIP |
DIP |
| package instruction |
, CAN8,.2 |
, CAN8,.2 |
SOP, SOP14,.4 |
SOP, SOP14,.4 |
DIP, DIP8,.3 |
DIP, DIP8,.3 |
| Contacts |
8 |
8 |
14 |
14 |
8 |
8 |
| Reach Compliance Code |
compliant |
compli |
compliant |
compliant |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
0.04 µA |
0.03 µA |
0.04 µA |
0.04 µA |
0.04 µA |
0.04 µA |
| Maximum bias current (IIB) at 25C |
0.03 µA |
0.02 µA |
0.03 µA |
0.03 µA |
0.03 µA |
0.03 µA |
| Nominal Common Mode Rejection Ratio |
102 dB |
102 dB |
102 dB |
102 dB |
102 dB |
102 dB |
| frequency compensation |
YES |
YES |
YES |
YES |
YES |
YES |
| Maximum input offset voltage |
5000 µV |
3000 µV |
5000 µV |
5000 µV |
5000 µV |
5000 µV |
| JESD-30 code |
O-MBCY-W8 |
O-MBCY-W8 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDIP-T8 |
R-PDIP-T8 |
| JESD-609 code |
e1 |
e1 |
e3 |
e3 |
e3 |
e3 |
| low-dissonance |
NO |
NO |
NO |
NO |
NO |
NO |
| micropower |
YES |
YES |
YES |
YES |
YES |
YES |
| Humidity sensitivity level |
1 |
1 |
3 |
3 |
1 |
1 |
| Negative supply voltage upper limit |
-22.5 V |
-22.5 V |
-22.5 V |
-22.5 V |
-3.5 V |
-22.5 V |
| Nominal Negative Supply Voltage (Vsup) |
-20 V |
-20 V |
-20 V |
-20 V |
-3.25 V |
-20 V |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
8 |
8 |
14 |
14 |
8 |
8 |
| Maximum operating temperature |
70 °C |
85 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| Package body material |
METAL |
METAL |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Encapsulate equivalent code |
CAN8,.2 |
CAN8,.2 |
SOP14,.4 |
SOP14,.4 |
DIP8,.3 |
DIP8,.3 |
| Package shape |
ROUND |
ROUND |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
CYLINDRICAL |
CYLINDRICAL |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
| power supply |
+-20 V |
+-20 V |
+-20 V |
+-20 V |
+-3.25 V |
+-20 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Nominal slew rate |
0.2 V/us |
0.2 V/us |
0.2 V/us |
0.2 V/us |
0.2 V/us |
0.2 V/us |
| Maximum slew rate |
0.57 mA |
0.5 mA |
0.57 mA |
0.57 mA |
0.57 mA |
0.57 mA |
| Supply voltage upper limit |
22.5 V |
22.5 V |
22.5 V |
22.5 V |
3.5 V |
22.5 V |
| Nominal supply voltage (Vsup) |
20 V |
20 V |
20 V |
20 V |
3.25 V |
20 V |
| surface mount |
NO |
NO |
YES |
YES |
NO |
NO |
| technology |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
| Temperature level |
COMMERCIAL |
OTHER |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
| Terminal form |
WIRE |
WIRE |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
BOTTOM |
BOTTOM |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
40 |
40 |
| Minimum voltage gain |
750 |
500 |
750 |
750 |
750 |
750 |
| Maker |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| length |
- |
- |
9 mm |
9 mm |
9.8171 mm |
9.8171 mm |
| encapsulated code |
- |
- |
SOP |
SOP |
DIP |
DIP |
| method of packing |
- |
- |
TAPE AND REEL |
RAIL |
RAIL |
RAIL |
| Maximum seat height |
- |
- |
2.65 mm |
2.65 mm |
5.08 mm |
5.08 mm |
| Terminal pitch |
- |
- |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
| width |
- |
- |
7.5 mm |
7.5 mm |
7.62 mm |
7.62 mm |