d. Maximum under Steady State conditions is 85 °C/W.
1
www.din-tek.jp
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 3 A
0.72
33
27
17
16
T
C
= 25 °C
5.4
70
1.1
65
54
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 1.5
Ω
I
D
≅
10 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 15 V, R
L
= 1.5
Ω
I
D
≅
10 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
0.2
V
DS
= 15 V, V
GS
= 10 V, I
D
= 10 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 10 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
3545
650
240
62
26.5
8.5
7.3
1.1
35
16
48
16
18
8
41
8
2.2
60
30
85
30
35
16
75
18
ns
Ω
95
40
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 1 mA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
=
10 V, I
D
= 15 A
V
GS
=
4.5 V, I
D
= 10 A
V
DS
= 15 V, I
D
= 15 A
30
0.0036
0.0052
75
0.0048
0.0060
1.2
30
27
- 5.6
2.5
± 100
1
10
V
mV/°C
V
nA
µA
A
Ω
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
DTP9530
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
70
V
GS
= 10 thru 4
V
56
I
D
- Drain Current (A)
I
D
- Drain Current (A)
V
GS
= 3
V
42
8
10
www.din-tek.jp
DTP9530
6
28
4
T
C
= 25 °C
2
T
C
= 125 °C
T
C
= - 55 °C
2
3
4
5
14
0
0.0
0
0.5
1.0
1.5
2.0
2.5
0
1
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.0045
4500
Transfer Characteristics
R
DS(on)
- On-Resistance (Ω)
0.0040
V
GS
= 4.5
V
C - Capacitance (pF)
3600
C
iss
0.0035
2700
0.0030
V
GS
= 10
V
1800
0.0025
900
C
rss
0
6
12
C
oss
0.0020
0
14
28
42
56
70
0
18
24
30
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 10 A
V
GS
- Gate-to-Source
Voltage
(V)
1.6
8
R
DS(on)
- On-Resistance
V
DS
= 15
V
V
DS
= 10
V
V
DS
= 20
V
1.8
I
D
= 15 A
Capacitance
V
GS
= 10
V
1.4
(Normalized)
6
1.2
V
GS
= 4.5
V
4
1.0
2
0.8
0
0
13
26
39
52
65
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
3
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.025
www.din-tek.jp
DTP9530
I
D
= 15 A
T
J
= 150 °C
T
J
= 25 °C
1
R
DS(on)
- On-Resistance (Ω)
10
I
S
- Source Current (A)
0.020
0.015
0.1
0.010
T
J
= 125 °C
0.005
T
J
= 25 °C
0
1
2
3
4
5
6
7
8
9
10
0.01
0.001
0.0
0.000
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
0.4
200
On-Resistance vs. Gate-to-Source Voltage
0.2
V
GS(th)
Variance
(V)
160
0.0
Power (W)
120
- 0.2
I
D
= 5 mA
- 0.4
I
D
= 250
µA
- 0.6
80
40
- 0.8
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (s)
1
10
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
Single Pulse Power
I
D
- Drain Current (A)
10
1 ms
10 ms
1
100 ms
1s
0.1
T
C
= 25 °C
Single Pulse
0.01
0.01
0.1
1
10
100
10 s
DC
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
4
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
35
7.5
www.din-tek.jp
DTP9530
28
I
D
- Drain Current (A)
6.0
14
Power (W)
0
25
50
75
100
21
4.5
3.0
7
1.5
0
125
150
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
2.0
Power Derating, Junction-to-Foot
1.6
Power (W)
1.2
0.8
0.4
0.0
0
25
50
75
100
125
150
T
A
- Ambient Temperature (°C)
Power, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
EPM 7128SLC84-10, I hope to use this chip to generate nanosecond pulses, using competitive risk. The main logic unit device used is the NOT gate, but the experimental results show that no matter how m...
[i=s]This post was last edited by wangerxian on 2022-6-1 13:31[/i]I recently used an MT3608 boost switch chip, but found that it could not be completely powered off. After the EN pin was pulled low, V...
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
