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BS250

Description
Small Signal Field-Effect Transistor, 0.25A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-92, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    The transistor   
File Size61KB,2 Pages
ManufacturerDiodes Incorporated
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BS250 Overview

Small Signal Field-Effect Transistor, 0.25A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-92, PLASTIC PACKAGE-3

BS250 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerDiodes Incorporated
Parts packaging codeTO-92
package instructionCYLINDRICAL, O-PBCY-W3
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage60 V
Maximum drain current (Abs) (ID)0.25 A
Maximum drain current (ID)0.25 A
Maximum drain-source on-resistance5 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-92
JESD-30 codeO-PBCY-W3
JESD-609 codee0
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formCYLINDRICAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeP-CHANNEL
Maximum power dissipation(Abs)0.83 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formWIRE
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
BS250
P-CHANNEL ENHANCEMENT MODE DMOS TRANSISTOR
Features
·
·
·
·
High Input Impedance
Fast Switching Speed
CMOS Logic Compatible Input
No Thermal Runaway or Secondary Breakdown
E
A
B
TO-92
Dim
A
B
Min
4.45
4.46
12.7
0.41
3.43
2.42
1.14
Max
4.70
4.70
0.63
3.68
2.67
1.40
Mechanical Data
·
·
·
·
Case: TO-92, Plastic
Leads: Solderable per MIL-STD-202,
Method 208
Pin Connection: See Diagram
Approx Weight: 0.18 grams
C
C
D
E
G
H
D
BOTTOM
VIEW
SG D
All Dimensions in mm
H
G
H
Maximum Ratings
Drain-Source Voltage
Drain-Gate Voltage
@ T
A
= 25°C unless otherwise specified
Characteristic
Symbol
–V
DSS
–V
DGS
V
GS
–I
D
P
d
T
j,
T
STG
Value
60
60
±20
250
830
-55 +150
Unit
V
V
V
mA
mW
°C
Gate-Source-Voltage (pulsed)
Drain Current (continuous)
Power Dissipation @T
C
= 25°C (Note 1)
Operating and Storage Temperature Range
Inverse Diode
@ T
A
= 25°C unless otherwise specified
Characteristic
Symbol
I
F
V
F
Value
0.15
0.85
Unit
A
V
Maximum Forward Current (continuous)
Forward Voltage Drop (Typ.) @ V
GS
= 0, I
F
= 0.15A, T
j
= 25°C
Electrical Characteristics
Characteristic
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage Current
Drain-Source Cutoff Current
Drain-Source ON Resistance
@ T
A
= 25°C unless otherwise specified
Symbol
-V
(BR)DSS
-V
GS(th)
-I
GSS
-I
DSS
r
DS (ON)
R
qJA
g
FS
C
iss
t
on
t
off
Min
60
Typ
70
1.0
3.5
150
60
5
25
Max
3.0
20
0.5
5.0
150
Unit
V
V
nA
µA
W
K/W
mS
pF
ns
Test Condition
I
D
= 100µA, V
GS
= 0
V
GS
= V
DS
, –I
D
= 1.0mA
-V
GS
= 15V, V
DS
= 0
-V
DS
= 25V, V
GS
= 0
-V
GS
= 10V, –I
D
= 0.2A
Note 1
-V
DS
= 10V, –I
D
= 0.2A,
f = 1.0MHz
-V
DS
= 10V, V
GS
= 0,
f = 1.0MHz
-V
GS
= 10V, –V
DS
= 10V,
R
D
= 100W
Thermal Resistance, Junction to Ambient Air
Forward Transconductance
Input Capacitance
Switching Times
Turn On Time
Turn Off Time
Notes:
1. Valid provided that leads are kept at ambient temperature at a distance of 2mm from case.
DS21902 Rev. D-3
1 of 2
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