Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: Voltage values except differential output voltages are with respect to network GND.
DISSIPATION RATING TABLE
PACKAGE
D
P
T
A
= 25 C
25°C
POWER RATING
725 mW
1000 mW
DERATING FACTOR
ABOVE T
A
= 25°C
5.8 mW/°C
8.0 mW/°C
T
A
= 70 C
70°C
POWER RATING
464 mW
640 mW
†
recommended operating conditions
MIN
Supply voltage, V
CC
High-level input voltage, V
IH
Low-level input voltage, V
IL
High-level output current, I
OH
Low-level output current, I
OL
Operating free-air temperature, T
A
0
4.75
2
0.8
−50
50
70
NOM
5
MAX
5.25
UNIT
V
V
V
mA
mA
°C
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
uA9638C
DUAL HIGH-SPEED DIFFERENTIAL LINE DRIVER
SLLS112C − OCTOBER 1980 − REVISED APRIL 1994
electrical characteristics over operating free-air temperature range (unless otherwise noted)
PARAMETER
V
IK
V
OH
V
OL
|V
OD1
|
|V
OD2
|
Δ|V
OD
|
V
OC
Δ|V
OC
|
Input clamp voltage
High level output voltage
High-level
Low-level
Low level output voltage
Magnitude of differential output voltage
Magnitude of differential output voltage
Change in magnitude of differential
output voltage
‡
Common-mode output voltage
§
Change in magnitude of common-mode
output voltage
‡
V
O
= 6 V
I
O
I
I
I
IH
I
IL
I
OS
I
CC
†
‡
TEST CONDITIONS
V
CC
= 4.75 V,
V
CC
= 4.75 V,
V
IL
= 0.8 V
V
CC
= 4.75 V,
I
OL
= 40 mA
V
CC
= 5.25 V,
I
I
= − 18 mA
V
IH
= 2 V,
V
IH
= 2 V,
I
O
= 0
I
OH
= − 10 mA
I
OH
= − 40 mA
V
IL
= 0.8 V,
MIN
2.5
2
TYP
†
−1
3.5
MAX
−1.2
UNIT
V
V
0.5
05
2V
OD2
2
V
V
V
V
CC
= 4.75 V to 5.25 V,
See Figure 1
R
L
= 100
Ω,
±
0 4
0.4
3
±
0 4
0.4
0.1
−0.1
100
−100
±
100
50
25
−200
−50
−150
45
65
V
V
V
Output current with power off
Input current
High-level input current
Low-level input current
Short-circuit output current
¶
Supply current (both drivers)
V
CC
= 0
V
CC
= 5.25 V,
V
CC
= 5.25 V,
V
CC
= 5.25 V,
V
CC
= 5.25 V,
V
CC
= 5.25 V,
V
O
= − 0.25 V
V
O
= − 0.25 V to 6 V
V
I
= 5.5 V
V
I
= 2.7 V
V
I
= 0.5 V
V
O
= 0
No load,
All inputs at 0 V
μA
μA
μA
μA
mA
mA
All typical values are at V
CC
= 5 V and T
A
= 25°C.
Δ
| V
OD
| and
Δ
| V
OC
| are the changes in magnitude of V
OD
and V
OC
, respectively, that occur when the input is changed from a high level to a
low level or vice versa.
§
In Standard EIA-422-A, V , which is the average of the two output voltages with respect to ground, is called output offset voltage, V .
OC
OS
¶
Only one output at a time should be shorted, and duration of the short circuit should not exceed one second.
switching characteristics, V
CC
= 5 V, T
A
= 25°C
PARAMETER
t
d(OD)
t
t(OD)
t
sk(o)
Differential output delay time
Differential output transition time
Output skew
C
L
= 15 pF,
pF
TEST CONDITIONS
R
L
= 100
Ω,
Ω
See Figure 2
See Figure 2
MIN
TYP
10
10
1
MAX
20
20
UNIT
ns
ns
ns
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
uA9638C
DUAL HIGH-SPEED DIFFERENTIAL LINE DRIVER
SLLS112C − OCTOBER 1980 − REVISED APRIL 1994
PARAMETER MEASUREMENT INFORMATION
50
Ω
Input
V
OD2
50
Ω
V
OC
Figure 1. Differential and Common-Mode Output Voltages
3V
Input
Y Output
C
L
Generator
(see Note A)
R
L
= 100
Ω
50
Ω
Z Output
C
L
= 15 pF
(see Note B)
Y Output
50%
t
sk(o)
Z Output
50%
50%
V
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
50%
t
sk(o)
t
d(OD)
Differential
Output
90%
10%
t
t(OD)
t
t(OD)
V
OH
V
OL
V
OH
90%
10%
1.5 V
1.5 V
0V
t
d(OD)
NOTES: A. The input pulse generator has the following characteristics: Z
O
= 50
Ω,
PRR
≤
500 kHz, t
w
= 100 ns, t
r
=
≤
5 ns.
B. C
L
includes probe and jig capacitance.
Figure 2. Test Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
12-Dec-2011
PACKAGING INFORMATION
Orderable Device
UA9638CD
UA9638CDE4
UA9638CDG4
UA9638CDR
UA9638CDRE4
UA9638CDRG4
UA9638CP
UA9638CPE4
(1)
Status
(1)
Package Type Package
Drawing
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
D
P
P
Pins
8
8
8
8
8
8
8
8
Package Qty
75
75
75
2500
2500
2500
50
50
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
Add to cart
Add to cart
Add to cart
Add to cart
Add to cart
Add to cart
Add to cart
Add to cart
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Pb-Free (RoHS)
Pb-Free (RoHS)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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