EDO DRAM Module, 8MX16, 60ns, CMOS, LEADLESS, STACK, TSOP-66
| Parameter Name | Attribute value |
| Maker | B&B Electronics Manufacturing Company |
| Parts packaging code | QMA |
| package instruction | , |
| Contacts | 66 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE WITH EDO |
| Maximum access time | 60 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-XQMA-N66 |
| memory density | 134217728 bit |
| Memory IC Type | EDO DRAM MODULE |
| memory width | 16 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 66 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8MX16 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | QUAD |
| DP3ED8MX16RY5-60C | DP3D8MX16RY5-70C | DP3D8MX16RY5-50C | DP3ED8MX16RY5-50C | DP3ED8MX16RY5-70C | |
|---|---|---|---|---|---|
| Description | EDO DRAM Module, 8MX16, 60ns, CMOS, LEADLESS, STACK, TSOP-66 | Fast Page DRAM Module, 8MX16, 70ns, CMOS, LEADLESS, STACK, TSOP-66 | Fast Page DRAM Module, 8MX16, 50ns, CMOS, LEADLESS, STACK, TSOP-66 | EDO DRAM Module, 8MX16, 50ns, CMOS, LEADLESS, STACK, TSOP-66 | EDO DRAM Module, 8MX16, 70ns, CMOS, LEADLESS, STACK, TSOP-66 |
| Parts packaging code | QMA | QMA | QMA | QMA | QMA |
| Contacts | 66 | 66 | 66 | 66 | 66 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE WITH EDO | FAST PAGE | FAST PAGE | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| Maximum access time | 60 ns | 70 ns | 50 ns | 50 ns | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-XQMA-N66 | R-XQMA-N66 | R-XQMA-N66 | R-XQMA-N66 | R-XQMA-N66 |
| memory density | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
| Memory IC Type | EDO DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
| memory width | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 66 | 66 | 66 | 66 | 66 |
| word count | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| character code | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | - | 1 | 1 | 1 | - |