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K6T0808C1D-RP700

Description
Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 8 X 13.40 MM, REVERSE, TSOP1-28
Categorystorage    storage   
File Size170KB,9 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K6T0808C1D-RP700 Overview

Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 8 X 13.40 MM, REVERSE, TSOP1-28

K6T0808C1D-RP700 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeTSOP
package instructionTSOP1-R,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
JESD-30 codeR-PDSO-G28
length11.8 mm
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1-R
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL
width8 mm
K6T0808C1D Family
Document Title
32Kx8 bit Low Power CMOS Static RAM
CMOS SRAM
Revision History
Revision No History
0.0
0.1
Initial draft
First revision
-
K
M62256DL/DLI I
SB1
= 100
50µA
KM62256DL-L I
SB1
= 20
10µA
KM62256DLI-L I
SB1
= 50
15µA
- C
IN
= 6
8pF, C
IO
= 8
10pF
- KM62256D-4/5/7 Family
tOH = 5
10ns
- KM62256DL/DLI I
DR
= 50→30µA
KM62256DL-L/DLI-L I
DR
= 30
15µA
Finalize
- Remove I
CC
write value
- Improved operating current
I
CC2
= 70
60mA
- Improved standby current
KM62256DL/DLI I
SB1
= 50
30µA
KM62256DL-L I
SB1
= 10
5µA
KM62256DLI-L I
SB1
= 15
5µA
- Improved data retention current
KM62256DL/DLI I
DR
= 30
5µA
KM62256DL-L/DLI-L I
DR
= 15
3µA
- Remove 45ns part from commercial product and 100ns part
from industrial product.
Replace test load 100pF to 50pF for 55ns part
Draft Data
May 18, 1997
April 1, 1997
Remark
Design target
Preliminily
1.0
November 11, 1997
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
Revision 1.01
November 1997
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